View ARGB1313HS-TR_9048791.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

argb1313hs - tr 3in1 top viewing type outer dimension 2.04 x 2.04 x 0.6mm ( l x w x h ) ? ultra - thin ? rgb tri - color emitting led ? lead C free soldering compatible ? rohs compliant dot matrix display, cellular phone, home appliances, amusement equipment , indicator, illumination ,etc. standard product reference sheet package features product features recommended applications page : 1 2014.4.23
argb1313hs - tr outline dimensions unit mm weight 3.4mg tolerance 0.1 recommended pad unit mm page : 2 pin connection inside circuit led (3 ) blue led(2) green led( 1 ) red anode cathode 2014.4.23 no. part name materials qty. led die algainp,ingan 3 mold resin silicone resin 2 substrate glass fabrics 1 electrode ag plating 1
argb1313hs - tr absolute maximum ratings 1. all leds emitted , forward current should not exceed max. total value of power dissipation. regarding total value of power dissipation when led emit at 60 or more, please refer to attached technical data. notes 2. i frm conditions pulse width Q 1ms, duty Q 1/20 specifications product overview (ta=25 ) 2 page : 3 2 2014.4.23 milky white green material emitting color lens color red algainp ingan blue ingan led die (3) led die (1) led die (2) forward current (2 or 3 leds emitted) repetitive peak forward current (1 led emitted) p d symbol ma mw ma 100 i frm units 0.750 0.750 0.500 0.750 ma/ mw ma/ 0.625 25 20 led die (1) red ma/ 0.750 storage temperature t opr reverse voltage 120 100 ma 240 1 30 30 30 120 30 40 85 operating temperature forward current (1 led emitted) i f led die (2) green 90 led die (3) blue pulse (1 led emitted) dc (2 or 3 leds emitted) derate linearly from 60 i f dc (1 led emitted) i f 100 item power dissipation total value of power dissipation t stg 2.5 2.5 2.5 current derate linearly p d i frm 40 100 5 v v r 5 5
argb1313hs - tr specifications electro - optical characteristics led die (1) red (ta=25 ) led die (2) green led die (3) blue (ta=25 ) (ta=25 ) all led emitted (ta=25 ) page : 4 2014.4.23 nm mcd 1.7 forward voltage luminous intensity dominant wavelength v f i v d typ. max. units 2.1 450 v 50 i f = 26ma 622 conditions min. i f = 26ma i f = 26ma item symbol 2.8 a reverse current i r v r = 5v 0.300 y 0.320 i v 1,350 mcd red : i f =26ma green : i f =22ma blue : i f =12ma x chromaticity coordinates item total luminous intensity min. conditions symbol units max. typ. a reverse current i r v r = 5v i f = 22ma item symbol 3.8 i f = 22ma conditions min. i f = 22ma 527 typ. max. units 3.2 850 v 50 2.7 forward voltage luminous intensity dominant wavelength v f i v d nm mcd nm mcd 2.4 forward voltage luminous intensity dominant wavelength v f i v d typ. max. units 3.1 180 v 50 i f = 12ma 473 conditions min. i f = 12ma i f = 12ma item symbol 3.8 a reverse current i r v r = 5v
argb1313hs - tr above table of chromaticity coordinates bins are range of actual measuring value at the production line of stanley electric. (tolerance : 0.02) notes chromaticity coordinates is sorted out into the following chart. sorting chart for chromaticity coordinates specifications page : 5 2014.4.23 red (i f =26ma) green (i f =22ma) blue (i f =12ma) 0.240 0.330 0.290 0.390 0.290 right down conditions 0.290 0.340 0.340 0.310 0.370 0.390 0.290 0.340 0.290 0.240 0.340 0.240 0.290 0.240 0.290 0.360 0.340 0.340 0.340 0.240 0.340 0.290 0.240 0.380 0.410 0.330 0.310 0.340 rank left down left upper right upper 0.320 0.290 0.290 0.340 0.280 0.290 0.360 0.390 0.370 0.390 0.260 0.340 0.230 0.240 y 0.360 0.420 0.340 0.360 0.410 0.340 0.390 0.390 0.260 0.270 0.310 0.390 0.320 0.390 0.240 0.280 0.290 0.290 0.290 0.290 0.290 0.340 0.310 0.340 0.340
argb1313hs - tr 0 50 100 -100 -50 0 50 100 - 30 - 60 - 90 60 30 0 90 100 50 0 50 100 x direction y direction 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 380 430 480 530 580 630 680 730 780 spatial distribution conditions : i f = 20ma , ta = 25 wavelength vs. relative intensity conditions : i f = 20ma , ta=25 wavelength: (nm ) relative intensity technical data (led die 1: red ) page : 6 x y relative intensity : (%) 2014.4.23
argb1313hs - tr 1 10 100 1.0 1.5 2.0 2.5 3.0 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 -40 -20 0 20 40 60 80 100 0.1 1.0 10.0 -40 -20 0 20 40 60 80 100 0.0 0.5 1.0 1.5 2.0 0 10 20 30 40 ambient temperature vs. relative intensity condition : i f = 20ma ambient temperature : ta ( ) forward voltage vs. forward current condition : ta = 25 forward voltage: v f ( v) forward current: i f ( ma) technical data ( led die 1: red ) forward current vs. relative intensity condition : ta = 25 forward current: i f ( ma) relative intensity relative intensity page : 7 ambient temperature vs. forward voltage condition : i f = 20ma ambient temperature : ta ( ) forward voltage : v f (v) 2014.4.23
argb1313hs - tr 0 20 40 60 80 100 -40 10 60 110 ambient temperature vs. power dissipation ambient temperature : ta ( ) 0 20 40 60 80 100 120 -40 10 60 110 duty=5% duty=10% duty=20% duty=50% dc 1 10 100 1 10 100 duty cycle vs. maximum forward current duty: (%) ambient temperature vs. maximum forward current repetition frequency : f R 50hz ambient temperature : ta ( ) 1 10 1 10 100 1,000 10,000 100,000 50hz 100hz 1khz 10khz technical data ( led die 1: red) power dissipation : pd ( mw) pulse width vs. maximum tolerable peak current condition : ta=25 pulse width : tw ( sec ) if peak max./i f dc max. (ma) maximum forward current : i f max. (ma) page : 8 maximum forward current : i f max. (ma) 2014.4.23
argb1313hs - tr 0 50 100 -100 -50 0 50 100 - 30 - 60 - 90 60 30 0 90 100 50 0 50 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 380 430 480 530 580 630 680 730 780 spatial distribution conditions : ta = 25 , i f =20ma wavelength: (nm ) relative intensity technical data (led die 2: green) page : 9 wavelength vs. relative intensity conditions : i f = 20ma , ta=25 x direction y direction x y relative intensity : (%) 2014.4.23
argb1313hs - tr 0.1 1.0 10.0 -40 -20 0 20 40 60 80 100 0.0 0.5 1.0 1.5 2.0 0 10 20 30 40 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 -40 -20 0 20 40 60 80 100 ambient temperature vs. forward voltage condition : i f = 20ma ambient temperature : ta ( ) 1 10 100 2.0 2.5 3.0 3.5 4.0 ambient temperature vs. relative intensity condition : i f = 20ma ambient temperature : ta ( ) forward voltage vs. forward current condition : ta = 25 forward voltage: v f ( v) forward current: i f ( ma) forward current vs. relative intensity condition : ta = 25 forward current: i f ( ma) relative intensity relative intensity page : 10 forward voltage : v f (v) technical data (led die 2: green) 2014.4.23
argb1313hs - tr 0 20 40 60 80 100 120 140 -40 10 60 110 ambient temperature vs. power dissipation ambient temperature : ta ( ) 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 duty=5% duty=10% duty=20% duty=50% dc ambient temperature vs. maximum forward current repetition frequency : f R 50hz ambient temperature : ta ( ) 1 10 1 10 100 1,000 10,000 100,000 50hz 100hz 1khz 10khz 1 10 100 1 10 100 duty cycle vs. maximum forward current duty: (%) power dissipation : pd ( mw) pulse width vs. maximum tolerable peak current condition : ta=25 pulse width : tw ( sec ) if peak max./i f dc max. (ma) maximum forward current : i f max. (ma) page : 11 maximum forward current : i f max. (ma) technical data (led die 2: green) 2014.4.23
argb1313hs - tr 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 380 430 480 530 580 630 680 730 780 spatial distribution condition: ta = 25 , i f =20ma wavelength: (nm ) relative intensity technical data (led die 3: blue) page : 12 relative intensity : (%) wavelength vs. relative intensity conditions : i f = 20ma , ta=25 0 50 100 -100 -50 0 50 100 - 30 - 60 - 90 60 30 0 90 100 50 0 50 100 x y x direction y direction 2014.4.23
argb1313hs - tr 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 -40 -20 0 20 40 60 80 100 0.1 1.0 10.0 -40 -20 0 20 40 60 80 100 0.0 0.5 1.0 1.5 2.0 0 10 20 30 40 ambient temperature vs. forward voltage condition : i f = 20ma ambient temperature : ta ( ) 1 10 100 2.0 2.5 3.0 3.5 4.0 ambient temperature vs. relative intensity condition : i f = 20ma ambient temperature : ta ( ) forward voltage vs. forward current condition : ta = 25 forward voltage: v f ( v) forward current: i f ( ma) forward current vs. relative intensity condition : ta = 25 forward current: i f ( ma) relative intensity relative intensity page : 13 forward voltage : v f (v) technical data (led die 3: blue) 2014.4.23
argb1313hs - tr 0 20 40 60 80 100 120 140 -40 10 60 110 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 duty=5% duty=10% duty=20% duty=50% dc ambient temperature vs. maximum forward current repetition frequency : f R 50hz ambient temperature : ta ( ) 1 10 1 10 100 1,000 10,000 100,000 50hz 100hz 1khz 10khz 1 10 100 1 10 100 ambient temperature vs. power dissipation ambient temperature : ta ( ) power dissipation : pd ( mw) pulse width vs. maximum tolerable peak current condition : ta=25 pulse width : tw ( sec ) if peak max./i f dc max. (ma) maximum forward current : i f max. (ma) page : 14 duty cycle vs. maximum forward current duty: (%) maximum forward current : i f max. (ma) technical data (led die 3: blue) 2014.4.23
argb1313hs - tr 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 380 430 480 530 580 630 680 730 780 0 50 100 -100 -50 0 50 100 - 30 - 60 - 90 60 30 0 90 100 50 0 50 100 spatial distribution conditions : ta=25 , i f = red : 26ma , green : 22ma , blue : 12ma wavelength: (nm ) relative intensity technical data (white) page : 15 relative intensity : (%) wavelength vs. relative intensity conditions : ta=25 , i f = red : 26ma , green : 22ma , blue : 12ma x y x direction y direction 2014.4.23
argb1313hs - tr 0 40 80 120 160 200 240 280 -40 10 60 110 0 10 20 30 40 50 60 -40 -20 0 20 40 60 80 100 dc 0 10 20 30 40 50 60 -40 -20 0 20 40 60 80 100 dc ambient temperature vs. maximum forward current green : 3 led emitting ambient temperature : ta ( ) 0 10 20 30 40 50 60 -40 -20 0 20 40 60 80 100 dc ambient temperature vs. maximum forward current blue : 3 led emitting ambient temperature : ta ( ) ambient temperature vs. maximum forward current red : 3 led emitting ambient temperature : ta ( ) maximum forward current : i f max. (ma) page : 16 ambient temp. vs. total value of power dissipation ambient temperature: ( ) power dissipation : pd . ( mw) technical data (white) maximum forward current : i f max. (ma) maximum forward current : i f max. (ma) 2014.4.23
argb1313hs - tr soldering conditions soldering precaution ( acc.to eiaj - 4701/300 ) 1. heat stress during soldering will influence the reliability of leds, however that effect will vary with heating method. also, if components with different shapes need to be mounted together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat stress (ex. smt led ). (recommended condition: soldering pad temp. > package temp.) 2. led parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials .). 3. recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. temperature distribution varies on heating method, pcb material, other components in the assembly , and mounting density . please do not repeat the heating process in reflow process more than twice. note 1 recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. this should be the maximum temperature for soldering. lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability . note 2 the reflow soldering process should be done up to twice(2 times max). when second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of led. the second soldering process should not be done until leds have returned to room temperature (by nature - cooling) after first soldering process. page : 17 2014.4.23 recommended reflow soldering condition. 40 sec max. 150 180 +1.5 +5 /s 260 max. - 1.5 - 5 /s 90 120 sec max. pre - heating (soldering 230 max. peak temperature
argb1313hs - tr soldering conditions recommended manual soldering condition. temperature of iron tip 350 max. soldering duration, time 3sec.max.,1 time chemical adaptability isopropyl alcohol trichloroethylene chlorothene acetone thinner 4. if soldering manually, stanley recommends using a soldering iron equipped with temperature control. during the actual soldering process , make sure that the soldering iron never touches the led itself, and avoid the led's electrode heating temperature reaching above the heating temperature of the solder pad. all repairs must be performed only once in the same spot, and please avoid reusing components. 5. in soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature, before using. also, please avoid applying any types of pressure to the soldered components before the solder has been cooled and hardened, as it may deteriorate solder performance and solder quality. 6. when using adhesive material for tentative fixatives, thermosetting resin or ultraviolet radiation (uv) setting resin with heat shall be recommended. the curing condition, temperature:150 max./ time:120sec.max . 7. flow soldering (dip soldering) is not recommended for this product. 8. isopropyl alcohol is recommended for cleaning. some chemicals, including freon substitute detergent could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. please review the reference chart below for cleaning. if water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the component before using. page : 18 2014.4.23
argb1313hs - tr handling precaution this kind of led lamp is highly sensitive to surge voltage generated by the on/off status change and discharges of static electricity through frictions with synthetic materials, which may cause severe damage to the die or undermine its reliability. damaged products may experience conditions such as extremely high reverse voltage, or a decrease of forward rise voltage, deteriorating its optical characteristic. stanley products are designed to withstand up to 1,000v under the eiaj ed - 4701/300 test ? 304 (hbm), and are packed with anti - static components. however, the following precautions and measures are vital in ensuring product quality during shipment. eiaj ed - 4701/300 304/hbm electrification model: c=100pf, r2=1.5k do not place electrified non - conductive materials near the led product. avoid led products from coming into contact with metallic materials.( should the metallic material be electrified , the sudden surge voltage will most likely damage the product .) avoid a working process which may cause the led product to rub against other materials . install ground wires for any equipment, where they can be installed, with measures to avoid static electricity surges . prepare a esd protective area by placing a conductive mattress (1m max.) and ionizer to remove any static electricity. operators should wear a protective wrist - strap. operators should wear conductive work - clothes and shoes. to handle the products directly, stanley recommends the use of ceramic, and not metallic, tweezers. 2. working environment a dry environment is more likely to cause static electricity. although a dry environment is ideal for storage state of led products, stanley recommends an environment with approximately 50% humidity after the soldering process. recommended static electricity level in the working environment is 150v, which is the same value as integrated circuits (which are sensitive to static electricity). for electric static discharge ( esd) 1. electrification/static electricity protection stanley recommends the following precautions in order to avoid product (die) damage from static electricity , when an operator and other materials electrified by friction coming in contact with the product. page : 19 2014.4.23
argb1313hs - tr handling precaution other precautions 1. stanley led lamps have semiconductor characteristics and are designed to ensure high reliability. however, the performance may vary depending on usage conditions 2. absolute maximum ratings are set to prevent led lamps from failing due to excess stress ( temperature , current, voltage, etc .). usage conditions must not exceed the ratings for a moment, nor do reach one item of absolute maximum ratings simultaneously . 3. in order to ensure high reliability from led lamps, variable factors that arise in actual usage conditions should be taken into account for designing. ( derating of typ., max forward voltage, etc.) 4. please insert straight protective resistors into the circuit in order to stabilize led operation and to prevent the device from igniting due to excess current . 5. please avoid the stick of foreign material because molding resin in the products have adhesiveness. and please don't touch lens portion. 6. please check the actual performance in the assembly because the specification sheets are described for led device only. 7. please refrain from looking directly at the light source of led at high output, as it may harm your vision. 8. the products are designed to operate without failure in recommended usage conditions. however, please take the necessary precautions to prevent fire, injury, and other damages should any malfunction or failure arise . 9. the products are manufactured to be used for ordinary electronic equipment. please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on). 10. when there is a process of supersonic wave welding etc. after mounting the product, there is a possibility of affecting on the reliability of junction part in package (junction part of die bonding and wire bonding). please make sure there is no problem before using . 11. the formal specification sheets shall be valid only by exchange of documents signed by both parties page : 20 2014.4.23
argb1313hs - tr recommendation handling precautions handling precautions for product mounting please adjust the load, the pick up point, the nozzle diameter etc . before mounting, because led might get destroyed due to overload and improper shape of nozzle. please set up vacuum breaker or air blower to make sure that product being put down on soldering pad after it being picked up by nozzle. no stress should be put on lens not only by nozzle but also other instruments, tools, parts, etc.. 1. load : less than 10n page : 21 2014.4.23
argb1313hs - tr packaging specifications this product is baked (moisture removal) before packaging, and is shipped in moisture - proof packaging (as shown below) to minimize moisture absorption during transportation and storage. however, with regard to storing the products, stanley recommends the use of dry - box under the following conditions is recommended. moisture - proof bag as the packaging is made of anti - static material but packaging box is not. the package should not be opened until immediately prior to its use, and please keep the time frame between package opening and soldering which is maximum 72h . if the device needs to be soldered twice, both soldering operations must be completed within the 72h. if any components should remain unused, please reseal the package and store them under the conditions described in the recommended storage condition above . this product must be required to perform baking process (moisture removal) for at 24h ( min .). C 72h(max .) at 60 5 degrees celsius if following conditions apply. 1. in the case of silica gel (blue) which indicates the moisture level within the package , changes or loses its blue color. 2 . in the case of time passes for 72h after the package is opened once . baking process should be performed after led having been taken out of the package . baking may be performed in the tape - reel form , however if it is performed with the reel stacked over one another, it may cause deformation of the reels and taping materials and later obstruct mounting. please handle only once it has returned to room temperature. provided that, baking process shall be 2 times max. time elapsed after package opening. in the case of the package unopened , 6 months under recommended storage condition . please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. recommended storage condition / products warranty period temperature +5 30 humidity under 70% page : 22 the electrodes of this led has been ag plated. therefore , keep led away from corrosivity gas or ag plating will be deteriorated . it causes quality problem (solderability, optical characteristics deterioration). when store this product, use airtight container. 2014.4.23
argb1313hs - tr fastener for re - storage after opening bag. customer's opening position. product label desiccant with indicator for moisture level is enclosed. 1 a no. part name materials remarks moisture - proof bag with aluminum layer pet+al+pe with esd protection packaging specifications heat sealing position (after product being put in) allowable leaving time means the maximum allowable leaving time after opening package, which depends on each led type. the allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. when judging if the allowable leaving time has exceeded or not, please subtract the soldering time. the allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. flow chart - package opening to mounting moisture - proof packaging specification page : 23 2014.4.23 yes no yes no yes no baking led under recommended condition product mounting unused-product remained return to moisture-proof package and seal finished reopen the moisture-proof package flow chartpackage opening to mounting stored under recommended condition moisture-proof package first time opening allowable leaving time exceeded (*) discoloration of silica gel
argb1313hs - tr packing box ( rohs ? elv compliant) type a material / box cardoard c5bf type b,c material / box cardoard k5bf partition cardoard k5bf packaging specifications page : 24 the above measure is all the reference value. the box is selected out of the above table by shipping quantity. box type outline dimension l w h (mm) capacity of the box type a 280 265 45 (mm) 3 reels type b 310 235 265 (mm) 15 reels type c 440 310 265 (mm) 30 reels b 2014.4.23 sym. part name matelrial remarks packing box corrugated cardboard without esd protection
argb1313hs - tr label specification ( acc.to jis - x0503(code - 39 )) product label a. parts number b. bar - code for parts number c . parts code (in - house identification code for each parts number) d. packed parts quantity e. bar - code for packed parts quantity f. lot number & rank (refer to lot number notational system for details) g. bar - code for lot number & rank opto device l abel a. customer name b. parts type c. parts code d. parts number e. packed parts quantity f. carton number g. shipping date h. bar - code for in - house identification number bar - code font : acc.to code - 39(jix0503) packaging specifications b a page : 25 2014.4.23
argb1313hs - tr taping and reel specifications ( acc.to jis - c0806 appearance note " - tr" means cathode side of leds should be placed on the sprocket - hole side. items specifications remarks leader area cover - tape cover - tape shall be longer than 300mm without carrier - tape the end of cover - tape shall be held with adhesive tape. carrier - tape empty pocket shall be more than 25pieces. please refer to the above figure for taping & reel orientation. trailer area empty pocket shall be more than 40pieces. the end of taping shall be inserted into a slit of the hub. page : 26 2014.4.23
argb1313hs - tr taping and reel specifications qty . per reel mechanical strength others qty./reel max. qty. of empty pocket remark 500 1 - 1,000 1 - 1,500 1 - 2,000 2 no continuance 2,500 2 no continuance 3,000 3 no continuance 3,500 3 no continuance 4,000 4 no continuance 4,000 parts/reel note1) note1 minimum qty. per reel might be 500 parts when getting less than 4,000 parts. in such case, parts of 500 - unit - qty . shall be packed in a reel and the qty. shall be identified on the label. cover - tape adhesive strength shall be 0.1 1.0n ( an angle between carrier - tape and cover - tape shall be170 deg. ) both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. reversed - orientation, up - side down placing, side placing and out of spec. parts mix shall not be held. max qty. of empty pocket per reel shall be defined as follows. page : 27 2014.4.23 (acc.to jis - c0806 - 03
argb1313hs - tr taping dimensions reel dimensions taping and reel specifications (acc.to jis - c0806 unit :mm page : 28 center hole center hole 2014.4.23 carrier-tape anti-static grade conductive grade cover-tape carrier-real anti-static grade no. part name remarks
argb1313hs - tr lot number notational system - 1digit production location (mark identify alphabet) - 1digit production year (last digit of production year 2009 9,2010 0,2011 1, ??? ) - 2digit production month (jan. to sep. , should be 01,02,03, ????? ) - 2digit production date - 3digit serial number - 2digit tape and reel following number - 2digit luminous intensity rank. (if luminous intensity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no l identified intensity rank, " - - " is used to indicate .) - 2digit chromaticity rank ( if chromaticity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate.) - 1digit option rank ( stanley normally print " - " to indicate) page : 29 2014.4.23
argb1313hs - tr correspondence to elv ? rohs instruction this product is in compliance with rohs ? elv. prohibition substance and it's criteria value of rohs ? elv are as follows. ? rohs instruction refer to following (1) (6). ? elv instruction . refer to following (1) (4). substance group name criteria value (1) lead and its compounds 1,000ppm max (2) cadmium and its compounds 100ppm max (3) mercury and its compounds 1,000ppm max (4) hexavalent chromium 1,000ppm max (5) pbb 1,000ppm max (6) pbde 1,000ppm max page : 30 2014.4.23
argb1313hs - tr reliability test test item applicable standard test condition duration failure operating life eiaj ed - 4701 /100(101) ta=25 i f = maximum rated current 1,000h 0 / 20 high temperature operating life eiaj ed - 4701 /100(101) ta=85 i f = maximum rated current 1 1,000h 0 / 20 low temperature operating life eiaj ed - 4701/100(101) ta = 40 i f = maximum rated current 1,000h 0 / 20 wet high temperature operating life eiaj ed - 4701/100(102) ta = 60 rh = 90% i f = maximum rated current 1,000h 0 / 20 thermal shock eiaj ed - 4701/100(105) ta = tstg max. tstg min. (each 15min) 200cycle s 0 / 20 resistance to reflow soldering eiaj ed - 4701/300(301) moisture soak 30 70% 72h preheating 150 180 90 120sec soldering 260 max. 2 times 0 / 20 electrostatic discharge (esd) eiaj ed - 4701/300(304) c=100pf r2=1.5k 1,000v 2 once each polarity 0 / 10 reliability testing result failure criteria 1 maximum rated current at maximum rated operating temperature 2 reference test page : 31 2014.4.23 cosmetic appearance - - notable discoloration, deformation and cracking luminous intensity i v i f =5ma testing min. value standard min. value 0.5 forward voltage v f i f =5ma testing max. value R standard max. value 1.2 reverse current i r v r =5v testing max. value R standard max. value 2.5 item symbol conditions failure criteria
argb1313hs - tr special notice to customers using the products and technical information shown in this data sheet 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not constitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4 ) the products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument). the application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine , home appliance and measuring instrument. 5) in order to export the products or technologies described in this data sheet which are under the foreign exchange and foreign trade control law, it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http:// www.stanley - components.com/en/ page : 32 2014.4.23

▲Up To Search▲

Price & Availability of ARGB1313HS-TR

	To Download ARGB1313HS-TR Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .