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lmv751 www.ti.com snos468e ? august 1999 ? revised march 2013 lmv751 low noise, low vos, single op amp check for samples: lmv751 1 features description the lmv751 is a high performance cmos 2 ? low noise 6.5nv/ hz operational amplifier intended for applications ? low v os (0.05mv typ.) requiring low noise and low input offset voltage. it ? wideband 4.5mhz gbp typ. offers modest bandwidth of 4.5mhz for very low supply current and is unity gain stable. ? low supply current 500ua typ. ? low supply voltage 2.7v to 5.0v the output stage is able to drive high capacitance, up to 1000pf and source or sink 8ma output current. ? ground-referenced inputs it is supplied in the space saving sot-23-5 tiny ? unity gain stable package. ? small package the lmv751 is designed to meet the demands of applications small size, low power, and high performance required by cellular phones and similar battery operated ? cellular phones portable electronics. ? portable equipment ? radio systems connection diagram figure 1. sot-23-5 top view figure 2. voltage noise figure 3. gain/phase 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 all trademarks are the property of their respective owners. production data information is current as of publication date. copyright ? 1999 ? 2013, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters.
lmv751 snos468e ? august 1999 ? revised march 2013 www.ti.com these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. absolute maximum ratings (1) (2) esd tolerance (3) human body model 2000v machine model 200v differential input voltage supply voltage supply voltage (v + - v ? ) 5.5v lead temperature (soldering, 10 sec.) 260 c storage temperature range ? 65 c to 150 c junction temperature (t j ) (4) 150 c (1) absolute maximum ratings indicate limits beyond which damage to the device may occur. electrical specifications do not apply when operating the device beyond its rated operating conditions. (2) if military/aerospace specified devices are required, please contact the texas instruments sales office/ distributors for availability and specifications. (3) human body model, 1.5k ? in series with 100pf. machine model, 200 ? in series with 1000pf. (4) the maximum power dissipation is a function of t j(max) , ja , and t a . the maximum allowable power dissipation at any ambient temperature is p d = (t j(max) - t a )/ ja . all numbers apply for packages soldered directly into a pc board. recommended operating conditions supply voltage 2.7v to 5.0v temperature range ? 40 c t j 85 c thermal resistance ( ja ) (1) dbv-5 package, sot-23-5 274 c/w (1) all numbers are typical, and apply to packages soldered directly onto pc board in still air. 2.7v electrical characteristics v + = 2.7v, v ? = 0v, v cm = 1.35v, t a = 25 c unless otherwise stated. boldface limits apply over the temperature range. typ limit symbol parameter condition units (1) (2) v os input offset voltage 0.05 1.0 mv 1.5 max v cm input common-mode voltage range for cmrr 50db 0 v min 1.4 1.3 v max cmrr common mode rejection ratio 0v < v cm < 1.3v 100 85 db 70 min psrr power supply rejection ratio v + = 2.7v to 5.0v 107 85 db 70 min i s supply current 0.5 0.8 ma 0.85 max i in input current 1.5 100 pa max i os input offset current 0.2 pa a vol voltage gain r l = 10k connect to v + /2 120 110 v o = 0.2v to 2.2v 95 db min r l = 2k connect to v + /2 120 100 v o = 0.2v to 2.2v 85 (1) typical values represent the most likely parametric norm. (2) all limits are ensured by testing or statistical analysis 2 submit documentation feedback copyright ? 1999 ? 2013, texas instruments incorporated product folder links: lmv751
lmv751 www.ti.com snos468e ? august 1999 ? revised march 2013 2.7v electrical characteristics (continued) v + = 2.7v, v ? = 0v, v cm = 1.35v, t a = 25 c unless otherwise stated. boldface limits apply over the temperature range. typ limit symbol parameter condition units (1) (2) v o positive voltage swing r l = 10k connect to v + /2 2.62 2.54 2.52 v min r l = 2k connect to v + /2 2.62 2.54 2.52 v o negative voltage swing r l = 10k connect to v + /2 78 140 160 mv max r l = 2k connect to v + /2 78 160 180 i o output current sourcing, v o = 0v 12 6.0 v in (diff) = 0.5v 1.5 ma min sinking, v o = 2.7v 11 6.0 v in (diff) = 0.5v 1.5 e n (10hz) input referred voltage noise 15.5 nv/ hz e n (1khz) input referred voltage noise 7 nv/ hz e n (30khz) input referred voltage noise 7 10 nv/ hz max i n (1khz) input referred current noise 0.01 pa/ hz gbw gain-bandwidth product 4.5 2 mhz min sr slew rate 2 v/ s 5.0v electrical characteristics v + = 5.0v, v ? = 0v, v cm = 2.5v, t a = 25 c unless otherwise stated. boldface limits apply over the temperature range. typ limit symbol parameter units (1) (2) v os input offset voltage 0.05 1.0 mv 1.5 max cmrr common mode rejection ratio 0v < v cm < 3.6v 103 85 db 70 min v cm input common-mode voltage range for cmrr 50db 0 v min 3.7 3.6 v max psrr power supply rejection ratio v + = 2.7v to 5.0v 107 85 db 70 min i s supply current 0.6 0.9 ma 0.95 max i in input current 1.5 100 pa max i os input offset current 0.2 pa a vol voltage gain r l = 10k connect to v + /2 120 110 db v o = 0.2v to 4.5v 95 min r l = 2k connect to v + /2 120 100 v o = 0.2v to 4.5v 85 v o positive voltage swing r l = 10k connect to v + /2 4.89 4.82 4.80 v min r l = 2k connect to v + /2 4.89 4.82 4.80 v o negative voltage swing r l = 10k connect to v + /2 86 160 180 mv max r l = 2k connect to v + /2 86 180 200 (1) typical values represent the most likely parametric norm. (2) all limits are ensured by testing or statistical analysis copyright ? 1999 ? 2013, texas instruments incorporated submit documentation feedback 3 product folder links: lmv751
lmv751 snos468e ? august 1999 ? revised march 2013 www.ti.com 5.0v electrical characteristics (continued) v + = 5.0v, v ? = 0v, v cm = 2.5v, t a = 25 c unless otherwise stated. boldface limits apply over the temperature range. typ limit symbol parameter units (1) (2) i o output current sourcing, v o = 0v 15 8.0 v in (diff) = 0.5v 2.5 ma min sinking, v o = 5v 20 8.0 v in (diff) = 0.5v 2.5 e n (10hz) input referred voltage noise 15 nv/ hz e n (1khz) input referred voltage noise 6.5 nv/ hz e n (30khz) input referred voltage noise 6.5 10 nv/ hz max i n (1khz) input referred current noise 0.01 pa/ hz gbw gain-bandwidth product 5 2 mhz min sr slew rate 2.3 v/ s 4 submit documentation feedback copyright ? 1999 ? 2013, texas instruments incorporated product folder links: lmv751
lmv751 www.ti.com snos468e ? august 1999 ? revised march 2013 typical performance characteristics v os supply current vs. vs. voltage v cm , v + = 2.7v figure 4. figure 5. v os source current vs. vs. v cm , v + = 5.0v out, v + = 2.7v figure 6. figure 7. source current vs. v out , v + = 5.0v gain/phase figure 8. figure 9. copyright ? 1999 ? 2013, texas instruments incorporated submit documentation feedback 5 product folder links: lmv751
lmv751 snos468e ? august 1999 ? revised march 2013 www.ti.com typical performance characteristics (continued) sinking current sinking current vs. vs. v out , v + = 2.7v v out , v + = 5.0v figure 10. figure 11. v os v in vs. vs. v + v out , v + = 2.7v, r l = 2k figure 12. figure 13. v in input bias vs. vs. v out , v + = 5.0v, r l = 2k v cm , t a = 25 c figure 14. figure 15. 6 submit documentation feedback copyright ? 1999 ? 2013, texas instruments incorporated product folder links: lmv751
lmv751 www.ti.com snos468e ? august 1999 ? revised march 2013 typical performance characteristics (continued) input bias vs. v cm , t a = 85 c psrr + figure 16. figure 17. psrr ? voltage noise figure 18. figure 19. cmrr figure 20. copyright ? 1999 ? 2013, texas instruments incorporated submit documentation feedback 7 product folder links: lmv751
lmv751 snos468e ? august 1999 ? revised march 2013 www.ti.com application hints noise there are many sources of noise in a system: thermal noise, shot noise, 1/f, popcorn noise, resistor noise, just to name a few. in addition to starting with a low noise op amp, such as the lmv751, careful attention to detail will result in the lowest overall noise for the system. to invert or not invert? both inverting and non-inverting amplifiers employ feedback to stabilize the closed loop gain of the block being designed. the loop gain (in decibels) equals the algebraic difference between the open loop and closed loop gains. feedback improves the total harmonic distortion (thd) and the output impedance. the various noise sources, when input referred, are amplified, not by the closed loop gain, but by the noise gain. for a non- inverting amplifier, the noise gain is equal to the closed loop gain, but for an inverting amplifier, the noise gain is equal to the closed loop gain plus one. for large gains, e.g., 100, the difference is negligible, but for small gains, such as one, the noise gain for the inverting amplifier would be two. this implies that non-inverting blocks are preferred at low gains. source impedance because noise sources are uncorrelated, the system noise is calculated by taking the rms sum of the various noise sources, that is, the square root of the sum of the squares. at very low source impedances, the voltage noise will dominate; at very high source impedances, the input noise current times the equivalent external resistance will dominate. for a detailed example calculation, refer to note 1 . bias current compensation resistor in cmos input op amps, the input bias currents are very low, so there is no need to use r comp (see figure 21 and figure 22 ) for bias current compensation that would normally be used with early generation bipolar op amps. in fact, inclusion of the resistor would act as another thermal noise source in the system, increasing the overall noise. figure 21. bias current compensation resistor figure 22. bias current compensation resistor resistor types thermal noise is generated by any passive resistive element. this noise is "white"; meaning it has a constant spectral density. thermal noise can be represented by a mean-square voltage generator e r 2 in series with a noiseless resistor, where e r 2 is given by: where: e r 2 = 4k trb (volts) 2 where ? t = temperature in k ? r = resistor value in ohms ? b = noise bandwidth in hz ? k = boltzmann's constant (1.38 x 10-23 w-sec/ k) (1) 8 submit documentation feedback copyright ? 1999 ? 2013, texas instruments incorporated product folder links: lmv751
lmv751 www.ti.com snos468e ? august 1999 ? revised march 2013 actual resistor noise measurements may have more noise than the calculated value. this additional noise component is known as excess noise. excess noise has a 1/f spectral response, and is proportional to the voltage drop across the resistor. it is convenient to define a noise index when referring to excess noise in resistors. the noise index is the rms value in uv of noise in the resistor per volt of dc drop across the resistor in a decade of frequency. noise index expressed in db is: ni = 20 log ((e ex /v dc ) x 10 6 ) db where ? e ex = resistor excess noise in uv per frequency decade ? v dc = dc voltage drop across the resistor (2) excess noise in carbon composition resistors corresponds to a large noise index of +10 db to -20 db. carbon film resistors have a noise index of -10 db to -25 db. metal film and wire wound resistors show the least amount of excess noise, with a noise index figure of -15 db to -40 db. other noise sources: as the op amp and resistor noise sources are decreased, other noise contributors will now be noticeable. small air currents across thermocouples will result in low frequency variations. any two dissimilar metals, such as the lead on the ic and the solder and copper foil of the pc board, will form a thermocouple. the source itself may also generate noise. an example would be a resistive bridge. all resistive sources generate thermal noise based on the same equation listed above under "resistor types". (2) putting it all together to a first approximation, the total input referred noise of an op amp is: e t 2 = e n 2 + e req 2 + (i n *req) 2 where ? req is the equivalent source resistance at the inputs (3) at low impedances, voltage noise dominates. at high impedances, current noise dominates. with a typical noise current on most cmos input op amps of 0.01 pa/ hz, the current noise contribution will be smaller than the voltage noise for req less than one megohm. other considerations comparator operation occasionally operational amplifiers are used as comparators. this is not optimum for the lmv751 for several reasons. first, the lmv751 is compensated for unity gain stability, so the speed will be less than could be obtained on the same process with a circuit specifically designed for comparator operation. second, op amp output stages are designed to be linear, and will not necessarily meet the logic levels required under all conditions. lastly, the lmv751 has the newer pnp-npn common emitter output stage, characteristic of many rail-to-rail output op amps. this means that when used in open loop applications, such as comparators, with very light loads, the output pnp will saturate, with the output current being diverted into the previous stage. as a result, the supply current will increase to the 20-30 ma. range. when used as a comparator, a resistive load between 2k ? and 10k ? should be used with a small amount of hysteresis to alleviate this problem. when used as an op amp, the closed loop gain will drive the inverting input to within a few millivolts of the non-inverting input. this will automatically reduce the output drive as the output settles to the correct value; thus it is only when used as a comparator that the current will increase to the tens of milliampere range. rail-to-rail because of the output stage discussed above, the lmv751 will swing ? rail-to-rail ? on the output. this normally means within a few hundred millivolts of each rail with a reasonable load. referring to the electrical characteristics table for 2.7v to 5.0v, it can be seen that this is true for resistive loads of 2k ? and 10k ? . the input stage consists of cascoded p-channel mosfets, so the input common mode range includes ground, but typically requires 1.2v to 1.3v headroom from the positive rail. this is better than the industry standard lm324 and lm358 that have pnp input stages, and the lmv751 has the advantage of much lower input bias currents. copyright ? 1999 ? 2013, texas instruments incorporated submit documentation feedback 9 product folder links: lmv751
lmv751 snos468e ? august 1999 ? revised march 2013 www.ti.com loading the lmv751 is a low noise, high speed op amp with excellent phase margin and stability. capacitive loads up to 1000 pf can be handled, but larger capacitive loads should be isolated from the output. the most straightforward way to do this is to put a resistor in series with the output. this resistor will also prevent excess power dissipation if the output is accidentally shorted. general circuits with the low noise and low input bias current, the lmv751 would be useful in active filters, integrators, current to voltage converters, low frequency sine wave generators, and instrumentation amplifiers. (3) note 1. sherwin, jim ? noise specs confusing? ? an-104 ( snva515 ), texas instruments. 2. christensen, john, ? noise-figure curve ease the selection of low-noise op amps ? , edn, pp 81- 84, aug. 4, 1994. 3. ? op amp circuit collection ? , an-31 ( snla140 ), texas instruments. 10 submit documentation feedback copyright ? 1999 ? 2013, texas instruments incorporated product folder links: lmv751
lmv751 www.ti.com snos468e ? august 1999 ? revised march 2013 revision history changes from revision d (march 2013) to revision e page ? changed layout of national data sheet to ti format .......................................................................................................... 10 copyright ? 1999 ? 2013, texas instruments incorporated submit documentation feedback 11 product folder links: lmv751
package option addendum www.ti.com 1-nov-2013 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples lmv751m5 nrnd sot-23 dbv 5 1000 tbd call ti call ti -40 to 85 a32a lmv751m5/nopb active sot-23 dbv 5 1000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 85 a32a lmv751m5x nrnd sot-23 dbv 5 3000 tbd call ti call ti -40 to 85 a32a lmv751m5x/nopb active sot-23 dbv 5 3000 green (rohs & no sb/br) cu sn level-1-260c-unlim -40 to 85 a32a (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and
package option addendum www.ti.com 1-nov-2013 addendum-page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant lmv751m5 sot-23 dbv 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lmv751m5/nopb sot-23 dbv 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lmv751m5x sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 lmv751m5x/nopb sot-23 dbv 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 q3 package materials information www.ti.com 26-mar-2013 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) lmv751m5 sot-23 dbv 5 1000 210.0 185.0 35.0 lmv751m5/nopb sot-23 dbv 5 1000 210.0 185.0 35.0 lmv751m5x sot-23 dbv 5 3000 210.0 185.0 35.0 lmv751m5x/nopb sot-23 dbv 5 3000 210.0 185.0 35.0 package materials information www.ti.com 26-mar-2013 pack materials-page 2

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