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1/ 20 www.rohm.co m tsz22111 ? 14 ? 001 ? 20 16 rohm co., ltd. all rights reserved. tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 18.nov.2016 rev.001 product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays synchronous boost dc/dc converter (load:500ma@vout=3.3v,vin=1.8v) BU33UV7NUX general description bu33 u v7nux is a synchronous buck - boost convertor with low power consumption and provide s a power supply for prod ucts powered by either two - cell alkalin e/ nicd / nimh or one - cell li - ion or li - polymer battery. out put currents can go as high as 5 00 ma while using two alkaline, and discharge it down to 1.8 v. bu33 u v7nux has reset circuit. (detection v oltage :1.5 v, r elease voltage :1.9 v) bu33 u v7nux output volta ge is fixed 3.3v by internal resistor divider. vout is connected with vin when vin voltage is higher than 3.3 v, features synchronous boost dc/dc converter iomax 5 00ma @vout=3.3v, vin=1.8v (ta=25 c ) disconnect function during en - off and uvlo auto - pfm/pwm (m ode=h (=vin) ), fixed pfm (mode=l (=0v) ) reset function ( d etect voltage = 1.5v ) pass - th rough function (vin > vout ) thermal shutdown 10 - pin vson010x3020 package key specifications input voltage range fixed output voltage efficiency current consumption start - up voltage 0.6 ~ 4 .5v 3.3 v 94% (max.) 7 a(mode=low) 13 a(mode=high) 0.9 v package w(typ) x d(typ) x h(max) vson010x3020 3.00mm x 2.00mm x 0.60mm applications single - cell or two - cell alkaline, nicd or nimh o r single - c ell li battery - powered products ic recorder s wireless mouse portable audio players cellular phones personal medical products remote control lers typical application circuit typical performance characteristics figure 1. application circuit figure 2. efficiency mode=h : auto - pfm/pwm mode=l : f ixed pfm 60 65 70 75 80 85 90 95 100 0.1 1 10 100 1000 efficiency [%] output current [ma] mode=h mode=l efficiency (vin=2.4v, vout=3.3v) datashee t en vin sw pgnd fb vout c0: 10uf agnd rstb vout c1 l0:4.7uh vin mode intldo c2: 1uf vin
2/ 20 tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b u33uv7nux pin configuration figure 3. pin configuration pin descriptions pin no. pin name function 1 intldo internal power supply 2 agnd gnd 3 fb output feedback 4 en en=vi n : power - on en=gnd : power - off 5 rstb low battery detect ion 6 mode mode =vin : auto - pfm/pwm mode =gnd : fixed pfm 7 vout boost voltage output 8 sw inductor connection 9 pgnd power gnd 10 vin power supply dont use en and mode pin at open. block diagram figure 4. circuit block control logic tsd osc level shift driver en pgnd sw vout vin swp swn fb enb ovp + - + - rstb enb + - mode vin agnd vin reset circuit detect voltage 1.5v release voltage 1.9v vin vin + - intldo ldo en 4 10 vin 8 sw 9 pgnd fb 3 7 vout agnd 2 rstb 5 6 mode intldo 1 (top view)
3/ 20 tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b u33uv7nux absolute maximum ratings (t j = 25c) parameter symbol ratings unit maximum applied voltage1 vmax1 6.5 v maximum applied voltage2 [intldo] vmax2 2.5 v junction temperature r ange t j - 40 +85 o c storage temperature range t stg - 55 +125 o c caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. thermal resistance (note 1) parameter symbol thermal resistance (typ) unit 1s ( note 3 ) 2s2p ( note 4) v son010x3020 junction to ambient j a 274.8 39.4 c /w junction to top characterization parameter ( note 2 ) jt 31 6 c /w (note 1) based on jesd 51 -2a(still-air) (note 2) the thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (note 3) using a pcb board based on jesd 51- 3. layer number of measurement board material board size single fr - 4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and t races 70 m (note 4) using a pcb board based on jesd 51- 5, 7. layer number of measurement board material board size thermal via (note 5) pitch diameter 4 layers fr - 4 114.3mm x 76.2mm x 1.6mmt 1.20mm 0.30mm top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2mm 35 m 74.2mm x 74.2mm 70 m (note 5) this thermal via connects with the copper pattern of all layers..
4/ 20 tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b u33uv7nux recommended operating conditions (tj= - 40c to +85 c ) par ameter symbol ratings unit condition power supply voltage range vin 0.6 (note 1 ) ~ 4 .5 v vin terminal voltage (note 1): when it is vout=3.3v electrical characteristics (unless otherwise specified v in =2.4v, l0=4.7uh, c1=22 f 2 , tj=25c) parameter symbol mi n. typ. max. unit condition circuit current1 icc1 - 2.7 8 .0 a en=0v, vin=1.2v circuit curren t2 icc2 - 7 18 a en=h,mode=l , device not switching circuit current3 icc3 - 13 2 5 a en=h,mode=h , device not switching switching frequency fsw 720 800 880 khz output voltage vout 3. 262 3.3 3.3 43 v io=1ma maximum output current1 imax1 50 - - ma mode=l, vin=1.8v maximum output current 2 imax 2 500 - - ma mode=h, vin=1.8v en input high vih_en 0.6 - - v en input low vil_en - - 0.2 v swn switch on resistance rswn - 14 0 - m swp switch on resistance rswp - 330 - m rst release threshold vrstr 1. 86 8 1.9 1.9 30 v rst detect threshold vrstd - 1.5 - v rst hysteresis rsthys - 0.4 - v rstb output low voltage vol - 0 0.1 v isink=20 a, vin=0.9v rstb output high voltage vo h vin - 0.5 - - v isource=1ma minimum start - up voltage vmin 0.875 0.9 0.925 v (note 1) minimum input voltage after start - up vminaft - 0. 26 0.6 v over current protection ocp 1. 3 1.5 5 1. 8 a ovp detect threshold ovpd 5.5 6 6.5 v vout rising discharge res istance r dis - 90 - (note 1) 3.3k resistive load, 3.3vout(1ma)
5/ 20 tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b u33uv7nux typical performance curves(unless oth er wise indicated, v in = 2.4 v, v out =3.3 v, l0=4.7uh,c1=22 f 2,ta=25 c ) figure 5 . efficiency vs output current ( efficiency , mode=l:fixed pfm) figure 6. efficien cy vs output current ( efficiency , mode=h:auto-pfm/pwm) figure 7 . output voltage vs output current ( load regulation , mode=l:fixed pfm) figure 8. output voltage vs output current ( load regulation , mode=h:auto-pfm/pwm) 2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 0 100 200 300 400 500 600 output voltage [ma] output current [ma] 0.9v 1.8v 2.4v 3.3v 0 10 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 100 1000 efficiency [%] output current [ma] 3.3v 3.0v 2.4v 1.8v 1.5v 1.2v 0.9v 2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 0 50 100 150 200 output voltage [v] output current [ma] 0.9v 1.8v 2.4v 3.3v 0 10 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 100 efficiency [%] output current [ma] 3.3v 3.0v 2.4v 1.8v 1.5v 1.2v 0.9v
6/ 20 tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b u33uv7nux typical performance curves - continued figure 9 . output voltage vs input voltage ( line regulation , mode=h:auto-pfm/pwm , 3.3k resistive load) figure 10. maximum output current vs input voltage ( maximum iout vs v in , en= h) figure 11 . circuit current vs input voltage (icc1 , en=mode=l, no load) figure 12. circuit current vs input voltage (icc2 , mode=l:fixed pfm, no load) 0 50 100 150 200 250 300 350 400 450 500 0 1 2 3 4 5 circuit current [a] input voltage [v] 0 100 200 300 400 500 600 700 0.0 0.5 1.0 1.5 2.0 maximum output current [ma] input voltage [v] mode=h:auto - pfm/pwm mode=l:fixed pfm 0 5 10 15 20 25 0 1 2 3 4 5 circuit current [a] input voltage [v] 0 1 2 3 4 5 6 0 1 2 3 4 5 output voltage [v] input voltage [v] - 50?c 25?c 105?c
7/ 20 tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b u33uv7nux typical performance curves - continued figure 13. circuit current vs input voltage (icc3 , mode=h:auto-pfm/pwm, no load) figure 14 . frequency vs input voltage ( frequency , mode=h:auto-pfm/pwm) figure 15. pmos on resistance vs in put voltage ( pmos on resistance , mode=h:auto-pfm/pwm) figure 16 . ripple voltage vs output current ( ripple , vin=2.4v) 0 10 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 100 1000 ripple voltage [mv] output current [ma] mode=h:auto - pfm/pwm mode=l:fixed pfm 600 700 800 900 1000 0 1 2 3 4 5 frequency [khz] input voltage [v] - 50?c 25?c 105?c 0 100 200 300 400 500 3.0 3.5 4.0 4.5 5.0 pmos on resistance [m] input voltage [v] 0 50 100 150 200 250 300 350 400 450 500 0 1 2 3 4 5 circuit current [a] input voltage [v]
8/ 20 tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b u33uv7nux typical performance curves - continued figure 17 . transient response (vin=2.4v, mode=l:fixed pfm, output current 1ma<->100ma) figure 18 . transient response (vin=2.4v, mode=l:fixed pfm, output current 1ma<->100ma) figure 19 . transient response (vin=2.4v, mode=h:auto-pfm/pwm , output current 1ma<->100ma) figure 20. transient response (vin=2.4v, mode=h:auto-pfm/pwm , output current 1ma<->100ma) ch2:vout [100mv/div, offset=3.3v] ch4:output current [50ma/div] time[500 s/div] ch2:vout [100mv/div, offset=3.3v] ch4:output current [50ma/div] time[500 s/div] ch2:vout [100mv/div, offset=3.3v] ch4:output current [50ma/div] time[100 s/div] ch2:vout [100mv/div, offset=3.3v] ch4:output current [50ma/div] time[100 s/div]
9/ 20 tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b u33uv7nux typical performance curves - continued figure 21. start-up waveform (vin=0.9v, 3.3k resistive load, mode=l:fixed pfm) figure 22. start-up waveform (vin=2.4v, 3.3k resistive load, mode=l:fixed pfm) figure 23. start-up waveform (vin=0.9v, 3.3k resistive load, mode=h:auto-pfm/pwm) figure 24 . start-up waveform (vin=2.4v, 3.3k resistive load, mode=h:auto-pfm/pwm) ch1:en [1v/div] ch2:vout [2v/div] ch3:icoil [500ma/div] ch1:en [1v/div] ch2:vout [2v/div] ch3:icoil [500ma/div] ch1:en [1v/div] ch2:vout [2v/div] ch3:icoil [500ma/div] ch1:en [1v/div] ch2:vout [2v/div] ch3:icoil [500ma/div]
10/ 20 tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 b u33uv7nux typical performance curves - continued figure 25 . shutdown waveform (vin=2.4v, output current=0ma, mode=l:fixed pfm) figure 26 . shutdown waveform (vin=2.4v, output current=0ma, mode=h:auto-pfm/pwm) ch1:en [2v/div] ch2:vout [2v/div] ch3:icoil [500ma/div] ch1:en [2v/div] ch2:vout [2v/div] ch3:icoil [500ma/div]
11 / 20 BU33UV7NUX tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 detailed description 1.) start-up (soft start) after being enabled, BU33UV7NUX starts the soft start operation. first ly , high side switch mosfet is turned on and the output voltage vout is lifted to the input voltage vin level, applying restriction to current. (current restriction operation ) for this operation, up to around 1ma resistive load is allowed. then, the device starts switching operation and vout is risen up to setting voltage adjusting the output slew rate by dac for soft start. (soft start operation) this soft start operation is reset by en, uvlo, tsd and scp. attention is necessary to change input rush current and start-up time by the output capacitor. figure 27. start-up (soft start) and shutdown operation 2.) discharge for output termi nal fb terminal is shorted to vout; the discharge tr. in the device is active. vout terminal is always discharged when dc/dc converter is in standby state. 3.) under voltage lock out (uvlo) uvlo prevents malfunction of the internal circuit at the time of rising or dropping to a lower value of power supply voltage. if the vin voltage becomes lower than 0.26v (typ.) , the dc/dc converter is turned off . in order to cancel uvlo of vin, it is necessary to set vin more than 0.9v (typ.). 4.) over voltage protection (ovp) BU33UV7NUX turns off the switching operation when the vout voltage becomes over ovpd. at that time, the vout terminal is not discharge (in the case that fb terminal is shorted to vout) . if the vout voltage becomes less than ovpd, movement returns it. 5.) over current protection (ocp) BU33UV7NUX has the function to limit the switching current. ocp detector is active during low side mosfet is in on state. when the heavy load is connected such that the peak of switching current ipeak is above ocp threshold , ocp function becomes active . on -time of low side mosfet is limited so that ipeak does not exceed ocp threshold, and vout vol tage decreases. 6.) short circuit protection (scp) BU33UV7NUX has automatic reboot type short current protect function. scp is detected when the vout voltage becomes lower than vin - 0.750v (typ.). at that moment, the switching operation is turned off and vout terminal is discharged (in the case that fb terminal is shorted to vout). then, the device starts the soft start operation for reboot without distinction of the value of the load resistance. if the vout terminal is shorted to gnd or the heavy load exceeding the specification value, the device keeps current restriction state. en vout vin slew rate control current restriction control fb pin = vout discharge tr. is active.
12/ 20 BU33UV7NUX tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 detailed description - continued figure 28 . output voltage in scp operation 7.) thermal shutdown (tsd) BU33UV7NUX turns off the switching operation when the device temperature exceeds the threshold value for the device protection. after the device temperature falls below the threshold value , the device starts the soft start operation. 8.) function select by mode pin with the mode pin, the BU33UV7NUX provides mode selection of pfm control or pfm/pwm automatic switching control. when load current is large, the product switches automatically to the pwm mode so that high efficiency is achievable over a wide range of load conditions. BU33UV7NUX operates under forced pwm mode to lower the output ripple when the input-output voltage difference is small at vin=3.2v~3.4v. the operation current increases when running at forced pwm mode. vout(3.3v) vin slew rate control vout terminal is shorted to ground. scp detect BU33UV7NUX turns off switching operation. current restriction control vin - 0.750v vout decrease by ocp. automatic reboot (soft start) vout(3.3v) 0v time interval (usec order) once dc/dc converter operation is turned off and vout terminal is discharged.
13/ 20 BU33UV7NUX tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 selection of components externally connected table 1. components for application characteristic curves name type value area (mm) height (max) (mm) rated voltage parts n umber manufacturer BU33UV7NUX boost converter 3.3v 3 2 0.6 7v BU33UV7NUX rohm c0 capacitor 10 f 2 1.25 0.85 16v emk212abj106kd - t taiyo yuden c1 ( note 1) capacitor 22 f 2 1.25 1.25 25v grm21br61e226me44l mu r ata capacitor 22 f 2 2 1.25 1.25 25v grm21br61e226me44l mu r ata c2 capacitor 1 f 1.6 0.8 0.8 16v c1608x5r1c105k tdk l0 inductor 4.7 h 5 4 1.5 vlf504015mt - 4r7m tdk (n ot e 1) : the effective load capacitance value considering accuracy, temperature characteristic and dc bias characteristic of output capacitors should not be less than 22 f . the amount of output capacitance will have a significant effect on the output ripple voltage. layout example figure 29. typical application circuit (pfm/pwm mode) top view figure 30. reference board layout (top layer) en vin sw pgnd fb vout c0 agnd rstb vout c1 l0 vin mode intldo vin c2
14/ 20 BU33UV7NUX tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 application information 1.) inductor selection inductor value of 4.7 h shows good performance over the whole input and output voltage range. the maximum value of inductor current (ipeak) can be estimated by using the following equations. ( : efficiency, il: output ripple voltage, f: switching frequency) the inductor should be selected as satisfying above ipeak value. ( 2 ) ( 1 ) ipeak figure 31 . switching current i sw ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ?? 2 il vin vout ioutipeak ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ?? f vout vinvout l vin il 1 i l i out(dc) i coil
15/ 20 BU33UV7NUX tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalent circuits pin name e quivalen t circuit en mode rstb sw intldo pin name e quivalen t circuit fb vout pgnd vin agnd sw agnd agnd sw vin agnd agnd vout agnd agnd rdis vin agnd agnd vout pgnd pgnd vin agnd agnd
16/ 20 BU33UV7NUX tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under s tr ong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input pin s when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pin s have voltages within the values specified in the electrical characteristics of this ic.
17/ 20 BU33UV7NUX tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 13. ceramic capacitor when using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and the maximum junction temperature rating are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ics maximum junction temperature rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit.
18/ 20 BU33UV7NUX tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ordering information b u 3 3 u v 7 n u x - e 2 part number package nux: vson010x3020 packaging and forming specification e2: embossed tape and reel marking diagram vson010x3020 (top view) uv7 part number marking lot number 1pin mark bu33
19/ 20 BU33UV7NUX tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name vson010x3020
20/ 20 BU33UV7NUX tsz02201 - 0q1q0 40 00 30 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 18.nov.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 18 .nov .201 6 001 new release
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (n ote1) m edical equipment c lassification of the s pecific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount products , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for products use. therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding the products maximum rating will not be applied to products. please take special care under dry condition (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label a two-dimensional barcode printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly using an authorized industry waste company. pre caution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BU33UV7NUX package vson010x3020 unit quantity 4000 minimum package quantity 4000 packing type taping constitution materials list inquiry rohs yes BU33UV7NUX - web page distribution inventory

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