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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 21 tsz02201-0j2j0a601090-1-2 ? 20 15 rohm co., ltd. all rights reserved. 02.nov.2015 rev.001 tsz22111 ? 14 ? 001 www.rohm.com 1.2v to v cc -1v, 0.55a 1ch ultra low dropout linear regulator BD3507HFV general description BD3507HFV is an ultra-low dropout linear regulator, which operates at a low input supply. the output voltage can be set by the vref terminal and can be synchronized with other power supplies. BD3507HFV can make up a highly efficient system due to the implementation of an ultra-low dropout n-channel mosfet with r on =300m? (typ). this ic utilizes a power package with radiation fins, making it useable for regulation with a load of up to 550ma. BD3507HFV is suitable as power supply for chipset bu s but it can also be used as a high side switch (r on = 300m?/l out = 550ma) of a low-voltage power supply line. external ceramic capacitors can be used as output capacitors for compact applications. features ? high-accuracy buffer circuit (adjustable from 0.65v to 2.7v) ? thermal shutdown protection circuit ? enable function ? over-current protection ? undervoltage lockout protection ? output ceramic capacitors applications notebook pc, desktop pc, digital camera, digital home appliances key specifications ? input voltage range: 1.2v to v cc - 1v ? supply voltage range: 4. 5v to 5.5v ? output current: 550m a (max) ? on -resistance: 300m? (typ) ? standby current: 0 a (typ) ? operating temperature range: -10c to + 10 0c package w(typ) x d(typ) x h(max) typical application circuit and block diagram hvsof6 1.60mm x 3.00mm x 0.75mm vref vref + - uvlo current limit en uvlo tsd en uvlo uvlo en uvlo tsd tsd en en en v cc enable in out out gnd in ceramic capacitor cl v cc en datashee t datashee t downloaded from: http:///
2/ 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 pin configuration pin descriptions pin no. pin name pin function 1 v cc vcc pin 2 en enable input pin 3 in input voltage pin 4 out output pin 5 vref reference voltage input pin 6 gnd ground pin reverse fin heat sink description of blocks 1. amp amp is an error amplifier that compares the reference volta ge (vref ) with out and drives the output n-channel fet . the frequency characteristics are optimized so that ceramic capacitors can be used as output capacitors and high -speed transient response can be achieved. the input v oltage range of the amp section is gnd-2.7v and the output voltage range of the amp section is gnd-vcc. when the regulator is off or uvlo, the output is brought to low level and the output of the n-channel fet is turned off. 2. en en is a logic input pin which controls the regulator on or off . when the regulator is off, the circuit current is maintained to 0a to reduce the standby current of the devic e . in addition, en turns on the fet that discharges vref and out to remove excess electric charge, and prevent malfunction of the ic at the output side. since the en pin has no electrical connection to the v cc terminal (as in the case where there is and esd diode), it doe s not depend on the input sequence. 3. uvlo uvlo turns off the output to prevent output voltage from malfunc tioning at the time when v cc voltage drops. same with en, uvlo discharges vref and out. when the voltage exceed s the threshold voltage (3.8v, typ), uvlo turns the output on . 4. current limit when the output is on and the output current exceeds the set c urrent limit threshold (0.6a or more), the output voltage is attenuated to protect the ic on the load side. when current decreas es, the output voltage is restored to the allowable value. 5. soft start adding external resistor and capacitor to vref pin can achiev e soft-start. the output rises in synchronism with vref pin until the time constant that is determined by c and r. overshoot of output voltage or inrush current can be prevented. 6. vref vref is a reference voltage input pin and sets the output voltage. since there is no electrical connection to the vcc terminal (as in the case where there is and esd diode), it does not depend on the input sequence. 7. tsd (thermal shut down) in order to prevent thermal breakdown and thermal runaway of th e ic, the output is turned off when chip temperature exceeds the threshold temperature. when the temperature decre ases below the threshold temperature, the output is restored. while the tsd circuit is designed to protect the ic in the occurrence of extreme heat, thermal design should consider not to exceed tj(max). 8. in the in line acts as the major current supply line, and is connected to the output n-channel fet drain. since there is no electrical connection with the vcc terminal, as in the case when an esd diode is connected, so its operation doe s not depend on the input sequence. however, because of the b ody diode of the output n-channel fet, there is electrical connection (diode connection) between in and out. con sequently, when the output is turned on and off by in, reverse current flows, in which case care must be taken. top view 1 2 3 4 5 6 gnd vref out vcc en in downloaded from: http:///
3/ 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 absolute maximum ratings (ta=25 c ) parameter symbol rating unit input voltage1 v cc 6.0 (note1) v input voltage2 v in 6.0 (note1) v enable input voltage v en 6.0 (note1) v power dissipation1 pd 1 0.85 (note 2) w power dissipation2 pd 2 1.40 (note 3) w operating temperature range topr - 10 to + 100 c storage temperature range tstg -55 to + 150 c maximum junction temperature tjmax +150 c (note 1) provided pd is not exceeded. (note 2) when mounted on a 70mm x 70mm x 1.6mm glass epoxy substrate (copper foil area: 2%). derate by 6.8 mw/c i n the case of ta25c. (note 3) when mounted on a 70mm x 70mm x 1.6mm glass epoxy substrate (copper foil area: 18% ). derate by 11.2 mw/c i n the case of ta25c . caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to con sider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=25 c ) parameter symbol rating unit min max input voltage1 v cc 4.5 5.5 v input voltage2 v in 1.2 v cc -1 v vref setup voltage v ref 0.65 2.7 v en input voltage v en -0.3 +5.5 v output current i o ut 0 550 ma electrical characteristics (unless otherwise noted, ta=25 c , v cc =5v, v in =1.8v, v vref =1.2v, v en =3v) parameter symbol standard value u nit conditions min typ max circuit current i cc - 0.4 0.7 ma standby current1 i stb - 0 10 a v en =0v standby current2 i instb - 0 10 a v en =0v output voltage1 v out1 1.188 1.200 1.212 v i out =0ma output voltage2 v out2 1.188 1.200 1.212 v i out =300ma output voltage3 v out3 1.176 1.200 1.224 v i out =0ma to 550ma v cc =4.5v to 5.5v ta=- 10 c to + 100 c (note 4) output voltage4 v out4 2.475 2.500 2.525 v v in =3.3v, v vref =2.5v i out =0ma output voltage5 v out5 2.475 2.500 2.525 v v in =3.3v, v vref =2.5v i out =300ma ou tput voltage6 v out6 2.450 2.500 2.550 v v in =3.3v, v vref =2.5v i out =0ma to 550ma v cc =4.5v to 5.5v ta=- 10 c to + 100 c (note 4) over-current protect i cl 600 - - ma output on-resistance r on - 300 550 m ? high level enable input voltage v en high 2.0 - - v en: sweep- up low level enable input voltage v enlow -0.2 - +0.8 v en: sweep-down enable pin input current i en - 7 10 a v en =3v uvlo off voltage v uvlo 3.5 3.8 4.1 v v cc : sweep- up uvlo hysteresis voltage v hys 100 160 220 mv v cc : sweep-down vref pin bias current i vref -0.1 - +0.1 a v vref =0v to 2.7 v (note 4) vref discharge on-resistance r onref - 1.0 2.0 k ? output discharge on-resistance r ondis - 0.1 0.3 k ? (note 4) not 100% tested downloaded from: http:///
4/ 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 typical performance curves figure 1. circuit current vs temperature temperature : ta (c) circuit current : i cc (ma) figure 2. i stb vs temperature temperature : ta (c) i stb ( a) figure 3. i in vs temperature temperature : ta (c) i in (ma) figure 4. i instb vs temperature temperature : ta (c) i in stb ( a) downloaded from: http:///
5/ 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 typical performance curves C continued figure 5. output voltage vs temperature temperature : ta (c) output voltage : v out (v) figure 8. enable pin input current vs temperature temperature : ta (c) enable pin input current : i en ( a) figure 7. vref discharge current (i refdis ) vs te mperature v vref =1.2v temperature : ta (c) i refdis (m a) figure 6. output discharge current (i odis ) vs temperature temperature : ta (c) i odis (ma) v out =1.2v downloaded from: http:///
6/ 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 typical performance curves C continued figure 10. ou tput on-resistance vs temperature temperature : ta (c) output on-resistance : r on (m ) figure 9. output on-resistance vs input voltage 1 200 250 300 350 400 450 500 4 4.5 5 5.5 6 vcc[v] ron[m] 2.5v 1.8v 1.2v input voltage 1 : v cc (v) output on-resistance : r on (m) downloaded from: http:///
7/ 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 typical waveforms figure 13. input sequence 1 en vref out vcc figure 14. input sequence 2 en vref out vcc figure 11. startup waveform en vref out figure 12. shutdown waveform en vref out downloaded from: http:///
8/ 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 typical waveforms C continued figure 15. input sequence 3 en vref out vcc figure 16. input sequence 4 en vref out vcc figure 17. input sequence 5 en vref out vcc figure 18. input sequence 6 en vref out vcc downloaded from: http:///
9/ 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 typical waveforms C continued figure 19. transient response (0 ma to 550ma/ s) v o ut i o ut figure 20. transient response (550ma to 0ma/ s) v o ut i o ut downloaded from: http:///
10 / 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 timing chart en on/off vcc on/off vref synchronous action in cc en vref out t in vcc en vref out t in vcc en vref out t hysteresis downloaded from: http:///
11 / 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 application information 1. application setting method part no value notes for use r 1 /r 2 22k/11k the output voltage can be set by external reference voltag e (v r ) and value of output volta ge setting resistors (r 1 , r 2 ). output voltage can be computed by v r x r 2 /(r 1 +r 2 ) but it is recommended to use at the r esistance value (total: about 10 k?) which is not suscep tible to v ref bias current (100na). c 3 22 f connect the output capacitor between out terminal and gnd te rminal without fail in order to stabilize output voltage. the output capacitor has a role to compensate for the phase of loop gain and to reduce output voltage fluctuation when load is ra pidly changed. when there is an insufficient capacit or value, there is a possibility to cause oscillation, and when the equivalent serial resistance (esr) of the capacitors is large, output voltag e fluctuation is increased when load is rapidly changed. about 22f ceramic capacitors are recommended but output capacito r greatly depends on temperature and load conditions. in ad dition, when various capacitors are connected in series, the total phase allowance of loop gain becomes in sufficient, and oscillation may result. thorough confirmation at application temperature and under load range conditions is requested. c 1 1 f the input capacitor plays a part to lower output impedance of a power supply connected to input terminals (v cc ). when output impedance of this power supply increases, the input voltages (v cc ) become unstable and there is a possibility of giving ri se to oscillation and degraded ripple rejection characteristics. the use of capacitors of about 1f with low esr, which provide less capacity value changes caused by temperature changes, i s recommended. but since the input capacitor greatly depends on characteristics of the power supply used for input, substrate wiring pattern, thorough confirmation under the application temperatu re and load range, is requested. c 2 10 f the input capacitor plays a part to lower output impedance of a power supply connected to input terminals (in ). when output impedance of this power supply increases, the input voltages (v in ) become unstable and there is a possibility of giving rise to oscillation and degraded rip ple rejection characteristics. the use of capacitors of about 10f with low esr, which provide less capacity value changes caused by temperature changes, is recommended. but since input capacitor greatly depends on characteristics of the power supply used for input, substrate wiring pattern, thorough confirmation under the application temperat ure and load range, is requested. c 4 1 f in this ic , the output voltage startup time can be set by vref terminal c apacitor (c 4 ) and r 1 and r 2 values. when en terminal is high or uvlo is reset, the desired output voltage is reached by the time constant determined by c 4 , r 1 , and r 2 . it is recommended to use capacitors (b special) with small capacitance va riations caused by temperature change for c 4 . v cc in vref vo en gnd v in on/off ceramic capacitor out v cc vref r 1 c 1 c 2 c 3 c 4 r 2 v r downloaded from: http:///
12 / 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 2. directions for pattern layout of pcb BD3507HFV evaluation board circuit BD3507HFV evaluation board application components part no value company parts name part no value company parts name u1 - rohm BD3507HFV c 1 1 f murata grm18 series r 5_1 22k rohm mcr03 series c 3 10 f murata grm21 series r 5_2 11k rohm mcr03 series c 4_1 22 f murata grm31 series c 4_2 c 5 1 f murata grm18 series BD3507HFV evaluation board layout silk screen top layer bottom layer mid layer 1 mid layer 2 gnd vcc c 1 en v cc sw v in c 3 vo c 4_1 c 4_2 c 5 r 5_1 vref vr r 5_2 vcc in en 1 2 3 6 5 4 u1 gnd vref out BD3507HFV downloaded from: http:///
13 / 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 3. heat loss in thermal design, consider the temperature range wherein th e ic is guaranteed to operate and apply appropriate margins. the temperature conditions that need to be consid ered are listed below: (1) ambient temperature ta shall be not more than 100c. (2) chip junction temperature tj shall be not more than 150c. chip junction temperature tj can be considered as follows: it is recommended to layout multiple vias, for heat radiatio n, in the gnd pattern of reverse (of ic) when there is the gnd pattern in the inner layer (in using multi-layer subs trate). this package is so small (size: 1.0 mm x 1.6 mm) to layout the via at the bottom of ic. spreading the pattern and inc reasing the number of via, as shown in the figure below, can achieve the most heat radiation characteristics. it is recommended that the size and number of via are designed suitable for the actual application (see figure below). most of heat loss in BD3507HFV occurs at the output n-chann el fet. power loss is determined by multiplying the voltage between v in and v out by the output current. be sure to confirm the in and out voltages used and output current conditions, and check with the thermal derating char acteristics. as this ic employs the power pkg, the thermal derating characteristics significantly depends on the pc board conditions. when designing, care must be taken to the size of a pc board to be used. power dissipation (w) = {input voltage (v in ) C output voltage (v out v ref )} x i out (average) ex.) if v in = 1.8v, v out =1.2v, and i out (average) = 0.5 a, the power dissipation is given by the fol lowing: chip junction temperature tj is found from ic surface temperature tc under actual application conditions: w cj tc tj ? ??? ? chip junction temperature tj is found from ambient temperature ta: w a j ta tj ? ??? ? < re ference value> j - c: hvsof6 30 c /w single-layer substrate (substrate surface copper foil area: 2% ) single-layer substrate (substrate surface copper foil area:18%) single-layer substrate (substrate surface copper foil area:51%) substrate size 70 x 70 x 1.6mm 3 j - a: hvsof6 147.1 c /w 89.3 c /w 73.5 c /w ? ? ? ? ? ? w3.0 a5.0 v2.1 v8.1 w n dissipatio power ? ? ? ? downloaded from: http:///
14 / 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 4. example of application circuit specifications: high side switch of low-voltage power supply line (1.2v - 2.5v) characteristics: r on = 300 m?, l out (max) = 550 ma, with soft start function and overheat protection cir cuit equipped. example circuit power dissipation hvsof 6 :pcb 1 st layer (cu-area : 2% ) ja = 147.1c/w :pcb 1 st layer (cu-area : 18%) ja = 89.3c/ w :pcb 1 st layer (cu-area : 51%) ja = 73.5c/w pcb size : 70mm x 70mm x 1.6mm 0.0 0.5 1.0 1.5 2.0 2.5 0 25 50 75 100 125 150 ambient temperature ta (c) power dissipation pd (w) 0.85w 1.40w 1.70w v cc in vref vo en gnd v in on/off ceramic capacitor out v cc vref r 1 c 1 c 2 c 3 c 4 v cc downloaded from: http:///
15 / 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 i/o equivalent circuits pin 1 (v cc ) pin 2 (en) pin 4 (out) pin 3 ( in ) vcc pin 5 (v ref) in downloaded from: http:///
16 / 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an externa l diod e between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supp ly lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pi n at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-si gnal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding thi s absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed un der the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that th e internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequen ce and delays, especially if the ic has more than one po wer supply. therefore, give special consideration to power cou pling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low- im pedance output pin may subject the ic to stress. always discharge capacitors compl etely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when moun ting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tra nsistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
17 / 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate l ayers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physica l damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 21. example of monolithic ic structure 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that preven ts heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the jun ction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage. 14. capacitor across output and gnd in the event a large capacitor is connected across output an d gnd, when vcc and in are short-circuited with 0v or gnd for some kind of reasons, current charged in the capacitor flows into the output and may destroy the ic. use a capacitor smaller than 1000 f between output and gnd. 15. input terminals (vcc, in ,en,vref) in the present ic, en terminal, in terminal, v cc terminal, and vref terminal have an independent construction . in addition, in order to prevent malfunction at the time of low inpu t, the uvlo function is equipped with the v cc terminal. they begin to start output voltage when all the terminals reach t hreshold voltage without depending on the input order of input terminals. 16. heat sink heatsink is connected to sub, which should be short-circui ted to gnd. solder the heatsink to a pc board properly, which offers lower thermal resistance. 17. operating range within the operating range, the operation and function of the circuits are generally guaranteed at an ambient temperature within the range specified. the values specified for electrical characteristics may no t be guaranteed, but drastic change may not occur to such characteristics with in the operating range. tsd on temperature [c] (typ) hysteresis temperature [ c] (typ) BD3507HFV 175 - 15 n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
18 / 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 operational notes C continued 18. for the present product, thoroughgoing quality control is ca rried out, but in the event that applied voltage, working temperature range, and other absolute maximum rating are exc eeded, the present product may be destroyed. because it is unable to identify the short mode, open mod e, etc., if any special mode is assumed, which exceeds the absolute maximum rating, physical safety measures are requested t o be taken, such as fuses, etc. 19. in the event that load containing a large inductance compone nt is connected to the output terminal, and generation of back-emf at the sta rt -up and when output is turned off is assumed, it is requested to ins ert a protection diode. hvsof6 land pattern land pitch e land space mie land length l2 land width b2 0.50 2.20 0.55 0.25 pad length d3 pad width e3 1.60 1.60 in actually designing, optimize in accordance with the condition. output pin (example) mie e3 d3 e b2 l2 unit: mm downloaded from: http:///
19 / 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 ordering information marking diagram b d 3 5 0 7 h f v - t r part number package hfv: hvso f6 packaging and forming specification tr : embossed tape and reel hvsof6 (top view) be part number marking lot number 1pin mark downloaded from: http:///
20 / 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 physical dimension, tape and reel information package name hvsof6 downloaded from: http:///
21 / 21 BD3507HFV ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601090-1-2 02.nov.2015 rev.001 revision history date revision changes 02.nov.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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