phy 1090 0b 10gbe linear transimpedance amplifie r 1b features ? 1100na rms maximum input referred noise ? linear up to 2 ma pp input level ? 2k ? typical transimpedance ? incorporates automatic gain control ? 3.3v power supply ? integrated pin filter capacitor & resistor ? oma - based rssi output current ? - 40c to +95c operating range ? 1.169mm x 0.929 mm die size 2b applications ? edc enabled receivers ? oc192 telecom systems ? ieee 10gbase - lrm receiver systems 3b description the phy 1090 is a high linearity transimpedance amplifier designed to be use d in fi ber optic modules for edc enabled 10gbps applications . the phy 1090 is optimised for applications requiring low distortion and low input referred noise , such as 10gbase - lrm . when c ombined with the phy 2 060 edc ic, the phy 1090 enable s a com plete edc - enabled receive path, ideally suited to the 10gbase - lrm ieee standard. the phy 1090 integrates a low noise transimpedance amplifier and an automatic gain control output stage to give a linear output over a wide dynamic range. it also integrates an rc filter in series with the photodiode cathode pads to reduce rosa cost. vss6 ate4 vss3 vcc1 ate5 ate2 ate1 filt1 vss1 vcc2 dp pda pdc1pdc2 vss5 rssi filt2 ate6 dn vss4 phy1090 1 2 3 4 5 6 7 8 9 10 11 12 ate3 vss2 13 14 15 16 17 18 19 20 21 22 amplifier r f signal detect & dc restore 50 ? 50 ? agc amp voltage regulator pda filt dp dn vcc ate4 ate5 ate6 ate1 ate2 ate3 pdc rssi rssi vss 200r 20pf figure 1: block diagram figure 2: pad layout a maxim integrated brand 19 - 5686 ; rev 1/11 phy1090 - rd - 1. 3 released datasheet page 1 downloaded from: http:///
1. 4b ordering information part number description phy1090 ds - wr phy1090 bare die in waffle pack phy1090 ds- fr phy1090 bare die o n film 2. 5b pad description s number nam e type description 1 filt1 analog series resistor to pdc, connected internally to filt2 2 vcc 1 pwr/gnd power supply connection 3 vcc 2 pwr/gnd power supply connection 4 ate1 test pads probe test pad - do not bond to these 5 dp analog serial data output + 6 vss1 pwr/gnd ground connection 7 ate2 test pads probe test pad - do not bond to these 8 vss2 pwr/gnd ground connection 9 ate3 test pads probe test pad - do not bond to these 10 ate4 test pads probe test pad - do not bond to these 11 vss3 pwr/gn d ground connection 12 ate5 test pads probe test pad - do not bond to these 13 vss4 pwr/gnd ground connection 14 dn analog serial data output 15 ate6 test pads probe test pad - do not bond to these 16 filt2 analog series resistor to pdc, connected int ernally to filt1 17 rssi analog current proportional to oma in dbm 18 vss5 pwr/gnd ground connection 19 pdc1 analog photodiode cathode connected internally to pdc2 20 pda analog photodiode anode 21 pdc2 analog photodiode cathode connected internally t o pdc1 22 vss6 pwr/gnd ground connection phy1090 - rd - 1. 3 released datasheet page 2 downloaded from: http:///
6b 3. device specifications 12b 3.1 absolute maximum ratings parameter conditions min typ max unit supply voltage - 0.5 6 v storage temperature - 55 +150 c pda input current a.c. er = 4. 0 mapp pda input curr ent d.c. 2. 0 ma operating temperature measured on die 115 c die attach temperature 400 c please note that functional device operat ion at these ratings is not guaranteed , nor implied . sustained stress at these ratings may affect device reliabi lity. 13b 3.2 esd and latch up ratings parameter conditions min typ max unit esd C all pins except pda jedec jesd - a114 (hbm) class 1c 2 kv esd C pda pin jedec jesd - a114 (hbm) class 1c 1 kv the d evice is not guaranteed to meet parametric specifications. permanent damage may be incurred by operating beyond these limits. 14b 3. 3 operating conditions parameter conditions min typ max unit supply voltage 2.95 3.3 3.65 v operating temperature measured on back side of die - 40 +95 c 15b 3. 4 parametric performa nce parametric performance is guaranteed over the specified operating conditions. 16b dc specifications parameter conditions min typ max unit supply current vcc = 3.3v 45 68 ma power supply rejection ratio (vdp - vdn) / vcc at 2mhz; no vcc decoupling 6 db (vdp - vdn) / vcc at 5 mhz; no vcc decoupling 14 db input bias voltage pda voltage; wrt vss 1 v transimpedance at 10mhz; input current =40uapp 1600 2000 2700 photodiode filter resistor 160 2 00 300 output resistance differential 80 100 120 phy1090 - rd - 1. 3 released datasheet page 3 downloaded from: http:///
ac specifications parameter condition min typ max unit - 3db bandwidth 1 over input current range: 150uapp - 1 mapp, 100 differential output load 5 6 ghz input current 1 2 mapp input referred noise 1 measured using 7.5ghz 4th order bessel filter; input current 150 app 1100 narms differential output swing 1 input current 150 app, 10.3gbps data filtered by 2.25ghz, 4th order bessel - thomson filter 240 300 360 mvpp differential output swi ng 1 input current 150 app - 10.3gbps back - to - back 200 mvpp low frequency cut - off 23uapp 15 khz output return loss, differential < 5ghz 8 20 db output return loss, single ended < 5ghz 8 20 db total harmonic distortion (thd) 0.1ghz sinusoidal input; er = 6.5db; current 100a pp - 600a pp 2 % total harmonic distortion (thd) 0.1ghz sinusoidal input; er = 6.5db; current = 0.75 - 2mapp 6.5 % gain flatness 1 100mhz - 5ghz; flatness referred to 100mhz; input current 150 app 1.5 db determi nistic jitter 1 2 7 - 1 prbs; input current 2mapp, 5db extinction ratio 50 100 muipp agc settling time within 10% of final value 40 s rssi accuracy ac input current 150a to 500a 30 % rssi response time 40 ms notes: 1 using the circui t below f or pd and bonding parameters (figure 3 ) : c pd = 0.3pf r pd = 15 ; - pd parasitics l pd _ in = 0.5nh r pd _ in = 500m ; - pda bond wire parasitics l out _ dp/dn = 0.5nh r out _ dp/dn = 250m - dp/dn bond wire parasitics l filter = 0.5nh r filter = 250m ; - filt bond wire parasitics l vcc = 0.3nh r vcc = 300m ; - combined vcc bond wire parasitics l vss = 0.1nh r vss = 100m - comb ined vss bond wire parasitics l pd_in r pd_in r pd c pd l pd_in r pd_in l filter r filter l filter r filter 3.3v l out_dp r out_dp l out_dn r out_dn l vss r vss gnd dout+ dout- (all 6 vss pads bonded) vss6 ate4 vss3 vcc1 ate5 ate2 ate1 filt1 vss1 vcc2 dp pda pdc1pdc2 vss5 rssi filt2 ate6 dn vss4 phy1090 1 2 3 4 5 6 7 8 9 10 11 12 ate3 vss2 13 14 15 16 17 18 19 20 21 22 figure 3 : photodiode and bonding parameters phy1090 - rd - 1. 3 released datasheet page 4 downloaded from: http:///
7b 4. device descrip tion amplifier r f signal detect & dc restore 50 ? 50 ? agc amp voltage regulator pda filt dp dn vcc ate4 ate5 ate6 ate1 ate2 ate3 pdc rssi rssi vss 200r 20pf figure 4: phy 1090 tia b lock d iagra m the phy1090 is a trans i mpedance amplifier (tia) designed for 10gbase - lrm applications. it provides t ypical measured average power sensitivity for a rosa featuring the phy1090 of better than - 18.5dbm at 10.3125gbps. this is based upon a back - to - back link and under the conditions specified in notes 1 and 2 of the parametric performance section. since sensitivity is strongly dependant upon both t he photo detectors capacitance and responsivity and individual rosa design and bonding, thi s typical measured sensitivity is for illustrative purposes only. 17b 4. 1 photodiode cathode supply the photodiode (pd) cathode power supply is connected externally. a 2 0pf capacitor and 2 00 ? resistor are integ rated into the phy 1090 to reduce cost of the rosa, though a dditional decoupling within the rosa may still be used. the pad layout of the phy1090 has been optimized for direct connection of the pd cathode (via the filt pin ) to vcc. alternatively, the pad l ayout also enables a pd cathode connection to a supply voltage external to the rosa . 18b 4.2 transimpedance & agc stages the transimpedance (current to voltage) amplifier (tia) stage is a very low noise amplifier with a feedback resistor to se t the gain. an i nternal voltage regulator with integrated stability components is used to power the front - end tia in order to improve the rejection of power supply noise. th e agc stage features automatic gain control, where by the gain is adjusted to maintain a fixed outp ut swing. this allows the output gain to remain linear over a wide range of input signal levels. the phy1090 agc gain control is a function of the peak input signal amplitude, not average input signal and has been optimized for dispersed input data. for the purposes of test evaluation, the effect of dispersion has been emulated in the ele ctrical domain by filtering the input data to the phy1090 using a 4th order bessel - thompson filter having a 2.25ghz bandwidth. this ensures sufficient eye closure to emul ate the effects of dispersion, and hence ensure correct operation of the phy1090 agc. in this case, 300mvpp d ifferential typical output swing will result. if a back - to - back test is performed without any filtering or dispersion, the measured output swing is typically 200mvppd. the tia output features a differential supply referenced voltage amplifier, and has 50 ? single ended output impedance. for optimum supply - noise rejection, the phy 1090 should be terminated differentially. phy1090 - rd - 1. 3 released datasheet page 5 downloaded from: http:///
10 100 1000 10 100 1000 tia oma input current ( app) tia output swing (mvpp diff) 2k <150 app 200 figure 5: phy1090 output vo ltage characteristic (filtered data) 19b 4.3 dc restore the direct - current cancellation uses low frequency feedback to remove the dc component of the in put signal. this has the effect of minimizing pulse - width distortions for signals with a 50% mark density. the dc cancellation circuit is internally compensated, and does not require any additional exter nal capacitors. 20b 4.4 rssi the phy1090 rssi output is designed to produce an oma - based power indication proportional to input oma. this can be used to generate a loss of signal indicator when used with a threshold detector as provided in the phy 2 060 edc enabled 10gbps receiver. the rssi detector has been designed to be most accurate from 150 app to 500 a , to allow the detection of a valid 10gbase - lrm signal . in this range the output rssi current is equal to 3x the input current. the rssi output is referenced to v cc . when used in conjunction with phyworks phy 2060 edc ic, it is recommended that the rssi current is connected to a ground (v ss ) referenced 1k resistor to generate a voltage indication that increases with increasing input oma. phy1090 - rd - 1. 3 released datasheet page 6 downloaded from: http:///
8b 5. typical application information 21b 5.1 bonding and layout in order to achieve optimal rosa performance , it is necessary to minimise noise pickup and the effects of parasitic components related to the tia bond - out . to this e nd , it is recommended that: ? all bond wire lengths should be kept to a minimum, especially supply and ground wires , to minimize inductive effects . ? bond wires carrying high speed signals be kept orthogonal to supply and ground bond w ires to minimize performance degradation through pick - up . ? the positive supply inside the rosa should be decoupled with a good quality capacitor. ? if external pd bias is implemented, the pd bias pin should be decoupled inside the rosa with a good quality capacitor. ? the pd capacitance should not exceed 0.3pf to minimize degradation of bandwidth and noise. ? bond ball should be centred and within the bond pad opening and should not occupy more than 75% of the bond pad area ? bond pressure of 20 - 25g is recommended, with a maximum ultrasonic power of 70mw for 20ms figure s 6 and 7 depict suggested bond - outs . note : whilst the phy1090 ac performance has been characterized for the bonding and pd parasitics stated in n ote 2 of the parametric performance section, improvements in rosa electrical bandwidth may be obtained by tuning the bond wire length between the pd anode pad and tia pda pad. however, t his may also adversely a ffect jitter and gain flatness performance. 5.2 msa compatibili ty figure 8 shows the phy1090s compatibility with the xmd rosa specification. note that pin 6 of the rosa flex can be the rssi output from the phy1090, or the photodiode bias voltage in the case of external bias configuration . 11b figure 6 : example 5 - pin to - 46 bond - out C internal pd bias ( top - view: looking into the header ) phy1090 - rd - 1. 3 released datasheet page 7 downloaded from: http:///
figure 7 : example 5 - pin to - 46 bond - out C external pd bias ( top - view: looking into the header) s uggested vcc decoupling capacitor value: 470pf suggested vpd decoupling capaci tor value: 200pf figure 8 : example flex - based rosa phy1090 - rd - 1. 3 released datasheet page 8 downloaded from: http:///
9b 6. die image, p ad positions and sizes die size: 1.169mm x 0.929 mm thickness: 290m +/ - 10m pda pdc pdc vss vss vss vss vss rssi vcc filt ate ate ate ate filt vcc pda pdc pdc vss vss ate1 vss vss dp ate4 rssi vcc filt ate2 vss vss ate5 filt vcc dn ate6 ate3 pin number pin name x (m) y (m) 1 filt1 80m x 80m, octagonal -2 58.9 339.5 2 vcc1 80m x 80m, rectangular - 159.5 339.5 3 vcc2 80m x 80m, rectangular - 61.5 339.5 4 ate1 80m x 80m, rectangular 122.5 339.5 5 dp 80m x 80m, octagonal 222 339.5 6 vss1 80m x 80m, rectangular 321.5 339.5 7 ate2 80m x 80m, rect angular 439.5 250 8 vss2 80m x 80m, octagonal 439.5 150 9 ate3 80m x 80m, octagonal 439.5 47.5 10 ate4 80m x 80m, octagonal 439.5 - 52.45 11 vss3 80m x 80m, rectangular 439.5 - 150 12 ate5 80m x 80m, rectangular 439.5 - 250 13 vss4 80m x 80m, rectangular 321.5 - 339.5 14 dn 80m x 80m, octagonal 222 - 339.5 15 ate6 80m x 80m, rectangular 121.6 - 339.5 16 filt2 80m x 80m, octagonal - 215 - 339.5 17 rssi 80m x 80m, octagonal - 315 - 339.5 phy1090 - rd - 1. 3 released datasheet page 9 downloaded from: http:///
18 vss5 80m x 80m, rectangular - 439.5 - 221.5 19 pdc1 80m x 80m, octagonal - 439.5 - 110.5 20 pda 80m x 80m, octagonal - 439.5 0 21 pdc2 80m x 80m, octagonal - 439.5 110.75 22 vss6 80m x 80m, rectangular - 439.5 221.5 10b contact information for technical support, contact maxim at www.maxim integrated.com/support . disclaimer this datasheet contains preliminary information and is subject to change. this document does not transfer or license any intellectual property rights to the user. it does not imply any commitment to produce the device described and is intended as a proposal for a new device. phyworks ltd assumes no liability or warranty for infringement of patent, copyright or other i ntellectual property rights through the use of this product. phyworks ltd assumes no liability for fitness for particular use or claims arising fr om sale or use of its products. phyworks ltd products are not intended for use in life critical or sustaining applications . phy1090 - rd - 1. 3 released datasheet page 10 downloaded from: http:///
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