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  73644-2110 Datasheet PDF File

For 73644-2110 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    0736440013

Molex Electronics Ltd.
Part No. 0736440013
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position G, 72 Circuits

File Size 159.09K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-106021100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0736440116 73644-0116

Molex Electronics Ltd.
Part No. 0736440116 73644-0116
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits

File Size 166.79K  /  4 Page

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Amphenol Communications Solutions

Part No. 10132798-012110LF
Description BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 10 position, 2.7mm height receptacle connector.
Tech specs    

Official Product Page

    0736440016

Molex Electronics Ltd.
Part No. 0736440016
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits

File Size 167.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 10132798-032110LF
Description BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 30 position, 2.7mm height receptacle connector.
Tech specs    

Official Product Page

    0736440017

Molex Electronics Ltd.
Part No. 0736440017
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits

File Size 167.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021211-00080T1LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 80 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    0736440106 73644-0106

Molex Electronics Ltd.
Part No. 0736440106 73644-0106
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 72 Circuits

File Size 159.08K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021211-000A0T4LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 100 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    90136-2110

Molex Electronics Ltd.
Part No. 90136-2110
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 10 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 10131318-2421100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Natural Color, 24 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    MOLEX INC
Part No. 35750-2110
Description 0.5 mm2, BRASS, TIN FINISH, RING TERMINAL

File Size 34.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 10131319-122110PLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 12 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    0736443112 SDA-73644-3112

Molex Electronics Ltd.
Part No. 0736443112 SDA-73644-3112
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header

File Size 174.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 10131319-082110PLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 8 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    SDA-73644-2208 0736442208

Molex Electronics Ltd.
Part No. SDA-73644-2208 0736442208
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header

File Size 174.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 10131319-2221100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    0736440011 SDA-73644-0011

Molex Electronics Ltd.
Part No. 0736440011 SDA-73644-0011
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header

File Size 166.79K  /  4 Page

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Amphenol Communications Solutions

Part No. 10131318-2021100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Natural Color, 20 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

For 73644-2110 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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