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  73644-2110 Datasheet PDF File

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    73644-2110

Molex Electronics Ltd.
Part No. 73644-2110
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position F, 72 Circuits
File Size 174.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 54121-106021100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    73644-2109

Molex Electronics Ltd.
Part No. 73644-2109
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position E, 72 Circuits
File Size 163.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 10132798-012110LF
Description BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 10 position, 2.7mm height receptacle connector.
Tech specs 　 　

Official Product Page

    73644-1202

Molex Electronics Ltd.
Part No. 73644-1202
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
File Size 167.27K  /  4 Page

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Amphenol Communications Solutions
Part No. 10132798-032110LF
Description BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 30 position, 2.7mm height receptacle connector.
Tech specs 　 　

Official Product Page

    73644-1207

Molex Electronics Ltd.
Part No. 73644-1207
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 167.28K  /  4 Page

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Amphenol Communications Solutions
Part No. 20021211-00080T1LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 80 Positions, 1.27 mm (.050in) Pitch.
Tech specs 　 　

Official Product Page

    73644-1206

Molex Electronics Ltd.
Part No. 73644-1206
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 144 Circuits
File Size 159.58K  /  4 Page

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Amphenol Communications Solutions
Part No. 20021211-000A0T4LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 100 Positions, 1.27 mm (.050in) Pitch.
Tech specs 　 　

Official Product Page

    73644-1204

Molex Electronics Ltd.
Part No. 73644-1204
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 144 Circuits
File Size 167.28K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131318-2421100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Natural Color, 24 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    73644-1205

Molex Electronics Ltd.
Part No. 73644-1205
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position C, 144 Circuits
File Size 167.28K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131319-122110PLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 12 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs 　 　

Official Product Page

    73644-1203

Molex Electronics Ltd.
Part No. 73644-1203
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 159.58K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131319-082110PLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 8 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs 　 　

Official Product Page

    73644-2001

Molex Electronics Ltd.
Part No. 73644-2001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position A, 72 Circuits
File Size 174.54K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131319-2221100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    73644-2009

Molex Electronics Ltd.
Part No. 73644-2009
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 72 Circuits
File Size 174.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131318-2021100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Natural Color, 20 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

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