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  76763-8501 Datasheet PDF File

For 76763-8501 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    ICST[Integrated Circuit Systems]
Part No. ICS8501BYT ICS8501 ICS8501BY
Description Low Skew 1-to-16 Differential Current Mode Fanout Buffer

File Size 159.69K  /  8 Page

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Rochester Electronics LLC

Part No. 8501002YC
Description 8501002YC - Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68 - Dual marked (MQ80186-6/BYC)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TVS8501V12

ON Semiconductor
Part No. TVS8501V12
Description    Transient Voltage Suppressors

File Size 52.58K  /  4 Page

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Rochester Electronics LLC

Part No. 8501001YA
Description 80186 - High-Integration 16-Bit Microprocessor, CQFP68 (8501001YA)
Tech specs    

Official Product Page

    85013-1029 0850131029

Molex Electronics Ltd.
Part No. 85013-1029 0850131029
Description 2.54mm (.100) Pitch DIN 41612 Header, Style R/2 Reverse, 0.6μm (24μ) Selective Gold (Au), 48 Circuits, with Beveled Metal Pins, Lead free

File Size 394.47K  /  9 Page

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Amphenol Communications Solutions

Part No. 95278-501-50LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850170359

Molex Electronics Ltd.
Part No. 0850170359
Description MOLEX Connector

File Size 87.58K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-501-18LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850130036 85013-0036

Molex Electronics Ltd.
Part No. 0850130036 85013-0036
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse,0.6um (24u) Selective Gold (Au)
MOLEX Connector

File Size 129.25K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850130012 85013-0012

Molex Electronics Ltd.
Part No. 0850130012 85013-0012
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 64 Circuits, 0.6μm (24μ) Selective Gold (Au), Lead free
MOLEX Connector

File Size 127.65K  /  5 Page

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Amphenol Communications Solutions

Part No. 68585-016LF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 40 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs    

Official Product Page

    0850130024 85013-0024

Molex Electronics Ltd.
Part No. 0850130024 85013-0024
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 0.6μm (24μ) Selective Gold (Au), 96 Circuits
MOLEX Connector

File Size 135.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501A08LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85013-0414 0850130414

Molex Electronics Ltd.
Part No. 85013-0414 0850130414
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, Style R Reverse,1um (40 u) Selective Gold (Au)

File Size 125.70K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501A30LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0767618501 76761-8501

Molex Electronics Ltd.
Part No. 0767618501 76761-8501
Description 2.00mm (.079) Pitch VHDM H Board-to-Board Backplane Header, Vertical, 6-Row, Guide Pin
2.00mm (.079") Pitch VHDM H Board-to-Board Backplane Header, Vertical, 6-Row, Guide Pin
MOLEX Connector

File Size 442.29K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-501B12LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850130074 85013-0074

Molex Electronics Ltd.
Part No. 0850130074 85013-0074
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 0.6μm (24μ) Selective Gold (Au), 48 Circuits, Lead free
MOLEX Connector

File Size 267.51K  /  8 Page

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Amphenol Communications Solutions

Part No. 95278-501B32LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

For 76763-8501 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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