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  76763-8501 Datasheet PDF File

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    76763-8501 0767638501

Molex Electronics Ltd.
Part No. 76763-8501 0767638501
Description 2.00mm (.079) Pitch VHDM庐 H Board-to-Board Backplane Header, Vertical, 6-Row, Open End Module, Open Ends Version, 60 Circuits, Pin Length 4.75mm (.187)
2.00mm (.079) Pitch VHDM? H Board-to-Board Backplane Header, Vertical, 6-Row, Open End Module, Open Ends Version, 60 Circuits, Pin Length 4.75mm (.187)

File Size 372.47K  /  4 Page

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Rochester Electronics LLC

Part No. 8501002YC
Description 8501002YC - Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68 - Dual marked (MQ80186-6/BYC)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    76763-9001 0767639001

Molex Electronics Ltd.
Part No. 76763-9001 0767639001
Description 2.00mm (.079") Pitch VHDM H Board-to-Board Backplane Header, Vertical, 6-Row, Open End Module
2.00mm (.079) Pitch VHDM H Board-to-Board Backplane Header, Vertical, 6-Row, Open End Module

File Size 372.36K  /  4 Page

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Rochester Electronics LLC

Part No. 8501001YA
Description 80186 - High-Integration 16-Bit Microprocessor, CQFP68 (8501001YA)
Tech specs    

Official Product Page

    0767632501 76763-2501

Molex Electronics Ltd.
Part No. 0767632501 76763-2501
Description 2.00mm (.079") Pitch VHDM庐 H Board-to-Board Backplane Header, Vertical, 6-Row,Open End Module, Open Ends Version, 150 Circuits, Pin Length 4.75mm (.187"), Tin/L
2.00mm (.079) Pitch VHDM? H Board-to-Board Backplane Header, Vertical, 6-Row,Open End Module, Open Ends Version, 150 Circuits, Pin Length 4.75mm (.187), Tin/Lead

File Size 369.31K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-501-50LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0767631001 76763-1001

Molex Electronics Ltd.
Part No. 0767631001 76763-1001
Description 2.00mm (.079") Pitch VHDM H Board-to-Board Backplane Header, Vertical, 6-Row, Open End Module
2.00mm (.079) Pitch VHDM H Board-to-Board Backplane Header, Vertical, 6-Row, Open End Module

File Size 369.16K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-501-18LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    HARWIN
Part No. H8501-XX
Description 0.8mm SOCKET ASSEMBLY

File Size 91.69K  /  1 Page

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Amphenol Communications Solutions

Part No. 95278-501-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    A8501

Allegro MicroSystems
Part No. A8501
Description 2 MHz, 4 Channel100 mA WLED/RGB Driver

File Size 576.75K  /  24 Page

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Amphenol Communications Solutions

Part No. 68585-016LF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 40 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs    

Official Product Page

    List of Unclassifed Manufac...
Part No. 85012
Description LTCC High Temperature Inductors 0.27x0.27 inch size

File Size 292.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 95278-501A08LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    Parallax Inc.
Part No. 28501
Description
File Size 119.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-501A30LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    H8501-46 H8501-01 H8501-05

Harwin Plc
Part No. H8501-46 H8501-01 H8501-05
Description 0.8mm SOCKET ASSEMBLY

File Size 70.85K  /  1 Page

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Amphenol Communications Solutions

Part No. 95278-501B12LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    ST Microelectronics
Part No. DB-85015-940
Description RF power amplifier using 1 x PD85015-E N-channel enhancement-mode lateral MOSFETs

File Size 505.71K  /  14 Page

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Amphenol Communications Solutions

Part No. 95278-501B32LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

For 76763-8501 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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