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Molex Electronics Ltd.
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Part No. |
76763-8501 0767638501
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Description |
2.00mm (.079) Pitch VHDM庐 H Board-to-Board Backplane Header, Vertical, 6-Row, Open End Module, Open Ends Version, 60 Circuits, Pin Length 4.75mm (.187) 2.00mm (.079) Pitch VHDM? H Board-to-Board Backplane Header, Vertical, 6-Row, Open End Module, Open Ends Version, 60 Circuits, Pin Length 4.75mm (.187)
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File Size |
372.47K /
4 Page |
View
it Online |
Download Datasheet
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Rochester Electronics LLC |
Part No. |
8501002YC
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Description |
8501002YC - Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68 - Dual marked (MQ80186-6/BYC)
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Tech specs |
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Official Product Page
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Rochester Electronics LLC |
Part No. |
8501001YA
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Description |
80186 - High-Integration 16-Bit Microprocessor, CQFP68 (8501001YA)
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0767632501 76763-2501
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Description |
2.00mm (.079") Pitch VHDM庐 H Board-to-Board Backplane Header, Vertical, 6-Row,Open End Module, Open Ends Version, 150 Circuits, Pin Length 4.75mm (.187"), Tin/L 2.00mm (.079) Pitch VHDM? H Board-to-Board Backplane Header, Vertical, 6-Row,Open End Module, Open Ends Version, 150 Circuits, Pin Length 4.75mm (.187), Tin/Lead
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File Size |
369.31K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
95278-501-50LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-501-18LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-501-08LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68585-016LF
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Description |
BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 40 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-501A08LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-501A30LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-501B12LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-501B32LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Price and Availability
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