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  wirebond Datasheet PDF File

For wirebond Found Datasheets File :: 255    Search Time::0.719ms    
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    MMBV3401LT1

ON Semiconductor
Part No. MMBV3401LT1
OCR Text ...gged pin structure coupled with wirebond construction for optimum reliability ? low capacitance ? 0.7 pf (typ) at v r = 20 vdc ? very low series resistance at 100 mhz ? 0.34 ohms (typ) @ i f = 10 madc maximum ratings rating symbol val...
Description Silicon Pin Diode

File Size 31.93K  /  4 Page

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    NBSG16BAR2

ON Semiconductor
Part No. NBSG16BAR2
OCR Text ... by having the both the die and wirebond pads on the same plane. when mounted, the leads are directly attached to the board without a spaceconsuming standoff which is inherent in a leaded package. figure 2 also illustrates how the ends of ...
Description 2.5 V/3.3 V SiGe Differential Receiver/Driver with RSECL Outputs

File Size 41.41K  /  4 Page

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    ITT, Corp.
Part No. HLMP-3519-F00XX HLMP-3317
OCR Text ...ithout damaging the led die and wirebond. it is not recommended that the device be operated at peak currents beyond the peak forward current listed in the absolute maximum ratings. figure 1. relative intensity vs. wavelength. 5 high effi...
Description T-13/4 (5 mm) High Intensity LED Lamps T 13 / 4毫米),高亮度发光二极管
T-13/4 (5 mm) High Intensity LED Lamps 的T 13 / 4毫米),高亮度发光二极管

File Size 201.97K  /  10 Page

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    MMVL3700T1-D

ON Semiconductor
Part No. MMVL3700T1-D
OCR Text ...gged pin structure coupled with wirebond construction for optimum reliability ? low series resistance @ 100 mhz ? r s = 0.7 ohms (typ) @ i f = 10 madc ? reverse breakdown voltage = 200 v (min) ? device marking: 4r maximum ratings symb...
Description High Voltage Silicon Pin Diode

File Size 34.98K  /  4 Page

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    Electronic Theatre Controls, Inc.
Part No. WC16P332-16GI
OCR Text ... visual inspection, method 2017 wirebond wirebond qual./destruct wire pull, per mil-std-883 method 2011 wirebond non-destruct pull, method 2023 temperature cycle method 1010 constant acceleration method 2001 fine leak final q.a. method 2009...
Description 68332 MONOLITHIC MICROCONTROLLER 68332整装单片

File Size 169.00K  /  4 Page

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    AGILENT TECHNOLOGIES INC
Part No. HLMP-1340-G0002 HLMP-1340-G0001
OCR Text ...ithout damaging the led die and wirebond. it is not recommended that the device be operated at peak currents beyond the peak forward current listed in the absolute maximum ratings. 3 electrical characteristics at t a = 25 c device test ...
Description T-1 SINGLE COLOR LED, HIGH EFFICIENCY RED, 3 mm

File Size 314.78K  /  15 Page

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For wirebond Found Datasheets File :: 255    Search Time::0.719ms    
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