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wirebond Datasheet PDF File

For wirebond Found Datasheets File :: 192 Search Time::1.75ms
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				White Electronic Designs Corporation
Part No.	WC16P332-16GI WC16P332-16GX WC16P332-16GC WC16P332-16GM
OCR Text	... SEAL BURN-IN METHOD 1015 wirebond QUAL./DESTRUCT WIRE PULL, PER MIL-STD-883 METHOD 2011 POST BURN-IN ELECTRICAL MARK FINAL Q.A. METHOD 2009 wirebond TEMPERATURE CYCLE METHOD 1010 wirebond NON-DESTRUCT PULL, METHOD 2023 ...
Description	68332 MONOLITHIC MICROCONTROLLER
File Size	127.63K / 4 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	NBSG11 NBSG111 NBSG11BA NBSG53A NBSG53ABA NBSG53AMN NBSG53AMNR2 NBSG86A NBSG86ABA
OCR Text	...to the package substrate by the wirebond method (figure 1), or by the flipchip direct attachment method (figure 2). the csp, pbga, and fcbga are the most common bga package types. a chip scale package (csp) can have either wirebond or flipc...
Description	2.5 V/3.3 V SiGe 1:2 Differential Clock Driver with RSECL Outputs 2.5 V/3.3 V SiGe 1:10 Differential Clock Driver with RSECL Outputs 2.5 V/3.3 V SiGe Selectable Differential Clock and Data D Flip-Flop/Clock Divider with Reset and OLS 2.5 V/3.3 V SiGe Differential Smart Gate with Output Level Select
File Size	57.39K / 8 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	FCCSP
OCR Text	...bump layout, replacing standard wirebond interconnect. the advantages of flip chip interconnect are twofold: it provides enhanced electrical performance over standard wirebond technology, and it allows for a smaller form factor due to inc...
Description	a flip chip solution in a CSP package format.
File Size	116.26K / 2 Page	View it Online	Download Datasheet

				RF MICRO DEVICES INC
Part No.	SDA-5000SB
OCR Text	...ss capa citor with the shortest wirebond length possible is recommended to prevent low frequency gain ripple. 3vto the output drain termination pad. this pad requires a suggested 1000pf bypass capacitor with the shortest wirebond leng th ...
Description	0 MHz - 35000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
File Size	557.80K / 8 Page	View it Online	Download Datasheet

				Electronic Theatre Controls, Inc.
Part No.	WC16P332-16GI
OCR Text	... visual inspection, method 2017 wirebond wirebond qual./destruct wire pull, per mil-std-883 method 2011 wirebond non-destruct pull, method 2023 temperature cycle method 1010 constant acceleration method 2001 fine leak final q.a. method 2009...
Description	68332 MONOLITHIC MICROCONTROLLER 68332整装单片
File Size	169.00K / 4 Page	View it Online	Download Datasheet

				MAXIM[Maxim Integrated Products]
Part No.	MAX3905 MAX3905_D
OCR Text	... region are all programmable by wirebond options. The power-reduction feature decreases output modulation by approximately 50%. The data squelch feature disables the VCSEL current when no data is present. The MAX3905 is available in die for...
Description	From old datasheet system 150Mbps Automotive VCSEL Driver
File Size	1,141.93K / 13 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor Maxim Integrated Products, Inc.
Part No.	MAX3905/D MAX3905
OCR Text	... region are all programmable by wirebond options. The power-reduction feature decreases output modulation by approximately 50%. The data squelch feature disables the VCSEL current when no data is present. The MAX3905 is available in die for...
Description	150Mbps Automotive VCSEL Driver 亦可150Mbps汽车VCSEL驱动
File Size	1,166.96K / 13 Page	View it Online	Download Datasheet

For wirebond Found Datasheets File :: 192 Search Time::1.75ms
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