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  73644-2110 Datasheet PDF File

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    73644-2117

Molex Electronics Ltd.
Part No. 73644-2117
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 163.63K  /  4 Page

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Amphenol Communications Solutions
Part No. 54121-106021100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    73644-3210

Molex Electronics Ltd.
Part No. 73644-3210
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position F, 144 Circuits
File Size 164.13K  /  4 Page

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Amphenol Communications Solutions
Part No. 10132798-012110LF
Description BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 10 position, 2.7mm height receptacle connector.
Tech specs 　 　

Official Product Page

    73644-2116

Molex Electronics Ltd.
Part No. 73644-2116
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits
File Size 163.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 10132798-032110LF
Description BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 30 position, 2.7mm height receptacle connector.
Tech specs 　 　

Official Product Page

    73644-2016

Molex Electronics Ltd.
Part No. 73644-2016
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
File Size 164.19K  /  4 Page

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Amphenol Communications Solutions
Part No. 20021211-00080T1LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 80 Positions, 1.27 mm (.050in) Pitch.
Tech specs 　 　

Official Product Page

    73644-2105

Molex Electronics Ltd.
Part No. 73644-2105
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 163.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 20021211-000A0T4LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 100 Positions, 1.27 mm (.050in) Pitch.
Tech specs 　 　

Official Product Page

    73644-2101

Molex Electronics Ltd.
Part No. 73644-2101
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 72 Circuits
File Size 163.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131318-2421100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Natural Color, 24 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    73644-1200

Molex Electronics Ltd.
Part No. 73644-1200
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
File Size 167.83K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131319-122110PLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 12 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs 　 　

Official Product Page

    73644-2018

Molex Electronics Ltd.
Part No. 73644-2018
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits
File Size 174.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131319-082110PLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 8 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs 　 　

Official Product Page

    73644-0005

Molex Electronics Ltd.
Part No. 73644-0005
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 166.78K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131319-2221100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    73644-2017

Molex Electronics Ltd.
Part No. 73644-2017
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits
File Size 164.18K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131318-2021100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Natural Color, 20 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

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