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LT114 DG418BDY 16C15 A41155 A41155 20CTQ VTS4010 A41155
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  1140-2009 Datasheet PDF File

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Part No. 1140-101K
Description 1 ELEMENT, 100 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR

File Size 19.26K  /  1 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1140-4126

Molex Electronics Ltd.
Part No. 1140-4126
Description Barrel Form Punch

File Size 11.60K  /  1 Page

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Amphenol Communications Solutions

Part No. 67292-009
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 18 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

   
Part No. 21140-AF
Description 0 CHANNEL(S), 100M bps, LOCAL AREA NETWORK CONTROLLER, PQFP144

File Size 314.99K  /  55 Page

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Amphenol Communications Solutions

Part No. 10121002-009LF
Description HPCE R/A Receptacle 16P12S
Tech specs    

Official Product Page

    1140-4018

Molex Electronics Ltd.
Part No. 1140-4018
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 61082-142009LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
Tech specs    

Official Product Page

   
Part No. 21140-AE
Description LAN Node Controller

File Size 1,022.35K  /  55 Page

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Amphenol Communications Solutions

Part No. 59112-T40-20-090LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 40 Positions.
Tech specs    

Official Product Page

    Digital Equipment
Part No. 21140
Description DEC Chip

File Size 1,461.58K  /  43 Page

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Amphenol Communications Solutions

Part No. 10119109-372009LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4032

Molex Electronics Ltd.
Part No. 1140-4032
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-807200950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4031

Molex Electronics Ltd.
Part No. 1140-4031
Description Conductor Punch

File Size 14.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-106200950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    1140-4028

Molex Electronics Ltd.
Part No. 1140-4028
Description Insulation Punch

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 10142632-009LF
Description Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Receptacle, 9 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    1140-4027

Molex Electronics Ltd.
Part No. 1140-4027
Description Conductor Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-103200950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 1140-2009 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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