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Amphenol Communications Solutions |
Part No. |
1140084168
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Description |
1140084168-Micro SD Normal Open H=1.55 NONE PUSH
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
51772-009LF
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Description |
PwrBlade®, Power Connectors, 11P 24S Right Angle Receptacle, Press Fit
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
51712-009LF
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Description |
PwrBlade®, Power Supply Connectors, 6P 20S Vertical Header.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
73932-2009LF
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Description |
5 Row Signal Header, Straight, Press-Fit, Wide body, 3 Mod
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Tech specs |
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Official Product Page
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SL Power Electronics
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Part No. |
DK-20096
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Description |
IEC SYSTEM FOR MUTUAL RECOGNITION OF TEST CERTIFICATES FOR ELECTRICAL EQUIPMENT (IECEE) CB SCHEME
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File Size |
186.04K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54242-807200950LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Applied Micro Circuits Corp. Applied Micro Circuits, Corp.
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Part No. |
S2009
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Description |
1.6 Gbps Quad Serial Backplane Device(用于高速串行数据传送的1.6 Gbps四串行收发器) 1.6 Gbps的四串行背板设备(用于高速串行数据传送的1.6 Gbps的四串行收发器)
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File Size |
1,875.48K /
42 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54122-106200950LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54242-103200950LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
67292-009
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Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 18 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10119109-372009LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10142632-009LF
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Description |
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Receptacle, 9 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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Tech specs |
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Official Product Page
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