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  turbulent Datasheet PDF File

For turbulent Found Datasheets File :: 134    Search Time::2.125ms    
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    SAA7214

NXP Semiconductors
Philips Semiconductors
Part No. SAA7214
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description Transport MPEG2 source decoder

File Size 67.26K  /  12 Page

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    TDA7040T TDA7040

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. TDA7040T TDA7040
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description Low voltage PLL stereo decoder

File Size 112.64K  /  11 Page

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    TDA8754 TDA8754H

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. TDA8754 TDA8754H
OCR Text ...be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thi...
Description Triple high speed ADC for LCD drive

File Size 76.97K  /  8 Page

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    PHILIPS[Philips Semiconductors]
NXP Semiconductors N.V.
Part No. TDA7050T TDA7050T/N3 TDA7050T/N3/S6
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description TDA7050T; Low voltage mono/stereo power amplifier
Low Voltage Mono/Stereo Power Amplifier(低压单声立体声功率放大器) 0.075 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8

File Size 47.19K  /  9 Page

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    74LVC1G04 74LVC1G04GW

Philips Semiconductors
Part No. 74LVC1G04 74LVC1G04GW
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description Single inverter

File Size 63.19K  /  12 Page

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    TDA6800 TDA6800T

NXP Semiconductors
Philips Semiconductors
Part No. TDA6800 TDA6800T
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description Video modulator circuit

File Size 49.59K  /  10 Page

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    74LVC1G00 74LVC1G00GW

Philips Semiconductors
Part No. 74LVC1G00 74LVC1G00GW
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description Single 2-input NAND gate

File Size 63.86K  /  12 Page

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    Philips
Part No. TDA1575T TDA1575T/V2
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description TDA1575T; FM front end circuit for CENELEC EN 55020 applications

File Size 174.10K  /  16 Page

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    TDA4820T

NXP Semiconductors
Philips Semiconductors
Part No. TDA4820T
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description Sync separation circuit for video applications

File Size 57.26K  /  10 Page

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