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  turbulent Datasheet PDF File

For turbulent Found Datasheets File :: 128    Search Time::1.578ms    
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    FFSMC10AW10

Cynergy3 Co
Part No. FFSMC10AW10
OCR Text turbulent liquid iso 9001 c e r t i f i e d competitive part number cross-reference available at: www.cynergy3.com ? 2007 cynergy3 components, all rights reserved. specifcations are subject to change without prior notice. cynergy3 compone...
Description FFSMC high power switch : turbulent liquid

File Size 251.63K  /  1 Page

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    LM10

Cynergy3 Co
Part No. LM10
OCR Text turbulent liquids & confned spaces iso 9001 c e r t i f i e d competitive part number cross-reference available at: www.cynergy3.com ? 2007 cynergy3 components, all rights reserved. specifcations are subject to change without prior notic...
Description switch for turbulent liquids & confined spaces

File Size 229.71K  /  1 Page

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    74AHCT1G02 74AHCT1G02GW 74AHC1G02 74AHC1G02GW

Philips Semiconductors
Part No. 74AHCT1G02 74AHCT1G02GW 74AHC1G02 74AHC1G02GW
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description 2-input NOR gate

File Size 80.65K  /  12 Page

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    74AHCT1G04 74AHCT1G04GW 74AHC1G04 74AHC1G04GW

Philips Semiconductors
Part No. 74AHCT1G04 74AHCT1G04GW 74AHC1G04 74AHC1G04GW
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description Inverter

File Size 79.87K  /  12 Page

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    74AHCT1G08 74AHCT1G08GW 74AHC1G08 74AHC1G08GW

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. 74AHCT1G08 74AHCT1G08GW 74AHC1G08 74AHC1G08GW
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description 2-input AND gate

File Size 80.01K  /  12 Page

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    74AHCT1G32 74AHCT1G32GW 74AHC1G32 74AHC1G32GW 74AHC1G32GW/T1

NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
Part No. 74AHCT1G32 74AHCT1G32GW 74AHC1G32 74AHC1G32GW 74AHC1G32GW/T1
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description IC-SM-CMOS LOGIC
2-input OR gate

File Size 80.51K  /  12 Page

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    74AHCT1G86 74AHCT1G86GW 74AHC1G86 74AHC1G86GW

Philips Semiconductors
Part No. 74AHCT1G86 74AHCT1G86GW 74AHC1G86 74AHC1G86GW
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description 2-input EXCLUSIVE-OR gate

File Size 61.06K  /  12 Page

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    PCA1673 PCA1673U PCA1672 PCA1672U PCA1675 PCA1675U PCA1676 PCA1676U/10 PCA1677 PCA1677U

Philips Semiconductors
Part No. PCA1673 PCA1673U PCA1672 PCA1672U PCA1675 PCA1675U PCA1676 PCA1676U/10 PCA1677 PCA1677U
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description 32 kHz watch circuits using a silver-oxide or a 3 V lithium battery

File Size 69.26K  /  12 Page

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    CGY2013G CGY2013GC1

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. CGY2013G CGY2013GC1
OCR Text ...be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thi...
Description GSM 4 W power amplifier

File Size 86.11K  /  12 Page

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    CGY2021G

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. CGY2021G
OCR Text ...be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thi...
Description DCS/PCS 2 W power amplifier

File Size 72.33K  /  12 Page

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