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For turbulent Found Datasheets File :: 134    Search Time::2.641ms    
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    UAA3592 UAA3592HN

Philips Semiconductors
NXP Semiconductors
Part No. UAA3592 UAA3592HN
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description Wideband Code Division Multiple / Access Frequency Division Duplex / Power Amplifier
Wideband code division multiple access frequency division duplex power amplifier

File Size 53.65K  /  12 Page

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    74AUC1G02 74AUC1G02GV 74AUC1G02GW

NXP Semiconductors
Integrated Circuit Solution Inc
PHILIPS[Philips Semiconductors]
Part No. 74AUC1G02 74AUC1G02GV 74AUC1G02GW
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description From old datasheet system
74AUC1G02 Single 2-input NOR gate

File Size 51.70K  /  12 Page

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    TDA7021T

Philips Semiconductors
Part No. TDA7021T
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description FM radio circuit for MTS

File Size 137.29K  /  13 Page

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    Philips
Part No. TDA7088T
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description FM receiver circuit for battery

File Size 94.05K  /  16 Page

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    Philips
Part No. 74HC7014
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description Hex non-inverting precision

File Size 51.56K  /  9 Page

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    Philips
Part No. CGY2105ATS
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description High dynamic range dual LNA

File Size 87.46K  /  16 Page

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    74AUC1G04 74AUC1G04GV 74AUC1G04GW

NXP Semiconductors
Philips Semiconductors
Part No. 74AUC1G04 74AUC1G04GV 74AUC1G04GW
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description 1.8V Single Inverter

File Size 49.42K  /  12 Page

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    74AUC1G32 74AUC1G32GW

Philips
NXP Semiconductors
Part No. 74AUC1G32 74AUC1G32GW
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description AUC SERIES, 2-INPUT OR GATE, PDSO5
1.8V Single 2-Input OR Gate

File Size 53.27K  /  12 Page

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    Philips
Part No. PCA167XSERIES PCA1673U/10/F2 PCA1675U/F2
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description 32 kHz watch circuits using a silver-oxide or a 3 V lithium battery

File Size 56.23K  /  12 Page

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    TDA7040T TDA7040T_CNV_2 TDA7040T/V2

Philips Semiconductors
Part No. TDA7040T TDA7040T_CNV_2 TDA7040T/V2
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description TDA7040T; Low voltage PLL stereo decoder
From old datasheet system

File Size 105.47K  /  11 Page

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For turbulent Found Datasheets File :: 134    Search Time::2.641ms    
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