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  turbulent Datasheet PDF File

For turbulent Found Datasheets File :: 134    Search Time::16.11ms    
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    TDA7021 TDA7021T

NXP
PHILIPS[Philips Semiconductors]
http://
Part No. TDA7021 TDA7021T
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description FM radio circuit for MTS

File Size 145.49K  /  13 Page

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    Philips
Part No. CGY2032BTS CGY2032BTS_2
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description DECT 500 mW power amplifier
From old datasheet system

File Size 73.43K  /  12 Page

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    Philips
Part No. TDA7010T TDA7010T_CNV_2 TDA7010T/V3
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description TDA7010T; FM radio circuit
From old datasheet system

File Size 176.06K  /  11 Page

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    74AUC1G08 74AUC1G08GW 74AUC1G08GV

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. 74AUC1G08 74AUC1G08GW 74AUC1G08GV
OCR Text ...e soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is prefer...
Description 1.8V Single 2-Input AND Gate
From old datasheet system

File Size 50.57K  /  12 Page

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    ASMC-PRB9-TW305 ASMC-PHB9-TW305 ASMC-PAB9-TW305 ASMC-PRB9-TX5A5 ASMC-PHB9-TX5A5 ASMC-PAB9-TX5A5 ASMC-PXB9-TXXXX ASMC-PAB

Agilent(Hewlett-Packard...
Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
http://
Part No. ASMC-PRB9-TW305 ASMC-PHB9-TW305 ASMC-PAB9-TW305 ASMC-PRB9-TX5A5 ASMC-PHB9-TX5A5 ASMC-PAB9-TX5A5 ASMC-PXB9-TXXXX ASMC-PAB9-TV005 ASMC-PAB9-TV0A5 ASMC-PAB9-TV0B5 ASMC-PAB9-TV0C5 ASMC-PAB9-TV0D5 ASMC-PAB9-TV0E5 ASMC-PAB9-TV0G5 ASMC-PAB9-TV0H5 ASMC-PAB9-TV0J5 ASMC-PAB9-TV0K5 ASMC-PAB9-TV0M5 ASMC-PAB9-TV0N5 ASMC-PAB9-TV0P5 ASMC-PAB9-TV0R5 ASMC-PAB9-TV0S5 ASMC-PAB9-TV305 ASMC-PAB9-TV3A5 ASMC-PAB9-TV3B5 ASMC-PAB9-TV3C5 ASMC-PAB9-TV3D5 ASMC-PAB9-TV3E5 ASMC-PAB9-TV3G5 ASMC-PAB9-TV3H5 ASMC-PAB9-TV3J5 ASMC-PAB9-TV3K5 ASMC-PAB9-TV3M5 ASMC-PAB9-TV3N5 ASMC-PAB9-TV3P5 ASMC-PAB9-TV3R5 ASMC-PAB9-TV3S5 ASMC-PAB9-TV405 ASMC-PAB9-TV4A5 ASMC-PAB9-TV4B5 ASMC-PAB9-TV4C5 ASMC-PAB9-TV4D5 ASMC-PAB9-TV4E5 ASMC-PAB9-TV4G5 ASMC-PAB9-TV4H5 ASMC-PAB9-TV4J5 ASMC-PAB9-TV4K5 ASMC-PAB9-TV4M5 ASMC-PAB9-TV4N5 ASMC-PAB9-TV4P5 ASMC-PAB9-TV4R5 ASMC-PAB9-TV4S5 ASMC-PAB9-TV505 ASMC-PAB9-TV5A5 ASMC-PAB9-TV5B5 ASMC-PAB9-TV5C5 ASMC-PAB9-TV5D5 ASMC-PAB9-TV5E5 ASMC-PAB9-TV5G5 ASMC-PAB9-TV5H5 ASMC-PAB9-TV5J5 ASMC-PAB9-TV5K5 ASMC-PAB9-TV5M5 ASMC-PAB9-TV5N5 ASMC-PAB9-TV5P5 ASMC-PAB9-TV5R5 ASMC-PAB9-TV5S5 ASMC-PAB9-TV705 ASMC-PAB9-TV7A5 ASMC-PAB9-TV7B5 ASMC-PAB9-TV7C5 ASMC-PAB9-TV7D5 ASMC-PAB9-TV7E5 ASMC-PAB9-TV7G5 ASMC-PAB9-TV7H5
OCR Text ...ee reflow soldering profile. turbulent WAVE 250 200 150 FLUXING LAMINAR WAVE HOT AIR KNIFE BOTTOM SIDE OF PC BOARD TEMPERATURE - C TOP SIDE OF PC BOARD CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB)...
Description ASMC-PHB9-TW005 · Envisium Power PLCC-4 Surface Mount LED
ASMC-PRB9-TV005 · Envisium Power PLCC-4 Surface Mount LED
ASMC-PAB9-TV005 · Envisium Power PLCC-4 Surface Mount LED

File Size 82.19K  /  9 Page

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    TDA1575T TDA1575

NXP Semiconductors N.V.
Philips Semiconductors
Part No. TDA1575T TDA1575
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description FM front end circuit for CENELEC EN 55020 applications

File Size 186.38K  /  16 Page

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    TDA1015T

Philips Semiconductors
NXP Semiconductors
Part No. TDA1015T
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description 0/5 W audio power amplifier
0,5 W audio power amplifier

File Size 70.45K  /  10 Page

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    TDA4663 TDA4663T

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. TDA4663 TDA4663T
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description Baseband delay line

File Size 64.18K  /  12 Page

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    Philips
Part No. 74HC7014D 74HC7014N
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description Hex non-inverting precision Schmitt-trigger

File Size 67.91K  /  10 Page

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    74HC1G04GW

Philips Semiconductors
Part No. 74HC1G04GW
OCR Text ...re observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The pack...
Description Inverter

File Size 77.49K  /  12 Page

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For turbulent Found Datasheets File :: 134    Search Time::16.11ms    
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