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SIRENZA[SIRENZA MICRODEVICES]
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Part No. |
SFT-0100
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OCR Text |
... a 0.1uF capacitor is required. wirebond length is critical and should be minimized. CVCC: An off chip bypass capacitor is required. wirebond length is critical and should be minimized. Ground wirebonds: The SFT-0100 has backside vias and b... |
Description |
Transimpedance Amplifier
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File Size |
158.12K /
4 Page |
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it Online |
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sirenza.com SIRENZA[SIRENZA MICRODEVICES]
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Part No. |
SLD-1000
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OCR Text |
...002
Impedances Referenced to wirebond/PCB Interface.
All Dimensions in Inches. wirebond Heights Referenced to Top Surface of Die.
Device under test
Input Matching Network Z source
Output Matching Network Z load
Zsource and Z... |
Description |
4 Watt Discrete LDMOS FET-Bare Die
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File Size |
324.11K /
5 Page |
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it Online |
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sirenza.com SIRENZA[SIRENZA MICRODEVICES]
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Part No. |
SLD-2000
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OCR Text |
...002
Impedances Referenced to wirebond/PCB Interface.
All Dimensions in Inches. wirebond Heights Referenced to Top Surface of Die.
Zsource and Zload are the optimal impedances presented to the SLD2000 when operating at 28V, Idq=150m... |
Description |
12 Watt Discrete LDMOS FET-Bare Die
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File Size |
466.68K /
5 Page |
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it Online |
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sirenza.com SIRENZA[SIRENZA MICRODEVICES]
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Part No. |
SLD-3091FZ
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OCR Text |
...0.1
Impedances Referenced to wirebond/PCB Interface.
Device under test
Input Matching Network Z source
Output Matching Network Z load
Zsource and Zload are the optimal impedances presented to the SLD-3091FZ when operating at 28... |
Description |
30 Watt Discrete LDMOS FET in Ceramic Flanged Package
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File Size |
347.38K /
8 Page |
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it Online |
Download Datasheet
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