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wirebond Datasheet PDF File

For wirebond Found Datasheets File :: 255 Search Time::0.766ms
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				Avago Technologies Ltd.
Part No.	HLMP-CY36-UX0DD HLMP-CY47-TW0DD HLMP-CY11-WZ0DD HLMP-CY26-VY0DD HLMP-CY12-WZ0DD HLMP-CY27-VY0DD HLMP-CYXX HLMP-CY46-TW0DD
OCR Text	...o the led chip die attach and wirebond. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. soldering condit...
Description	Precision Optical Performance 5mm Round Warm White LED Lamps 精密光学性能圆头暖白光LED
File Size	253.51K / 9 Page	View it Online	Download Datasheet

				LRC[Leshan Radio Company]
Part No.	MMVL3401T1
OCR Text	...gged PIN Structure Coupled with wirebond Construction for Optimum Reliability * Low Capacitance - 0.7 pF Typ at VR = 20 Vdc * Very Low Series Resistance at 100 MHz - 0.34 Ohms (Typ) @ IF = 10 mAdc * Device Marking: 4D 1 SILICON PIN SWIT...
Description	Silicon Pin Diode
File Size	74.08K / 2 Page	View it Online	Download Datasheet

				Agilent(Hewlett-Packard)
Part No.	HLMP-1503
OCR Text	...ithout damaging the led die and wirebond. it is not recommended that the device be operated at peak currents beyond the peak forward current listed in the absolute maximum ratings. 3 electrical characteristics at t a = 25 c (cont.) devi...
Description	T-1 (3 mm) Diffused LED Lamps(T-1 (3 mm) 扩散LED照明
File Size	167.13K / 7 Page	View it Online	Download Datasheet

				Agilent(Hewlett-Packard)
Part No.	HLMP-1521 HLMP-1520 HLMP-1340-G0000
OCR Text	...ithout damaging the led die and wirebond. it is not recommended that the device be operated at peak currents beyond the peak forward current listed in the absolute maximum ratings. 3 electrical characteristics at t a = 25 c device test ...
Description	T-1 (3 mm) High Intensity LED Lamps(T-1 (3 mm) 高亮LED照明
File Size	192.01K / 6 Page	View it Online	Download Datasheet

				Microsemi
Part No.	MXP7A01
OCR Text	...its benefits large wirebond contact pad low contact resistance low crosstalk between photo diodes product highlight product highlight product highlight product highlight characteristic...
Description	GaAs PIN Photo Detectors
File Size	94.63K / 2 Page	View it Online	Download Datasheet

				Microsemi
Part No.	MXP7A02
OCR Text	...its benefits large wirebond contact pad low contact resistance low crosstalk between photo diodes product highlight product highlight product highlight product highlight characterist...
Description	GaAs PIN Photo Detectors
File Size	76.60K / 2 Page	View it Online	Download Datasheet

				Avago Technologies Ltd. Avago Technologies, Ltd.
Part No.	HLMP-NS31-J00XX HLMP-NM31-R00XX
OCR Text	... the led chip die attached and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering condition: ? care must be taken during pcb assembly and sold...
Description	T-1 (3mm) InGaN LED Lamps 的T 1毫米）的InGaN LED灯具
File Size	183.37K / 6 Page	View it Online	Download Datasheet

				Agilent(Hewlett-Packard) HIROSE ELECTRIC Co., Ltd.
Part No.	HLMP-0401-B0000 HLMP-R100 HLMP-0301-C0000 HLMP-0504-B0000
OCR Text	...ithout damaging the led die and wirebond. it is not recommended that the device be operated at peak current beyond the peak forward current listed in the absolute maximum ratings. axial luminous intensity v hlmp- 0301-c0000/ -0301 hlmp- 040...
Description	2.5 mm x 7.6 mm Rectangular LED Lamps(2.5 mm x 7.6 mm 矩形LED灯（黄色 2.5 mm x 7.6 mm Rectangular LED Lamps(2.5 mm x 7.6 mm 矩形LED灯（红色 2.5 mm x 7.6 mm Rectangular LED Lamps(2.5 mm x 7.6 mm 矩形LED灯（绿色 2.5毫米x七点六毫米矩形LED灯具.5毫米×七点六毫米矩形LED灯（绿色）） SINGLE COLOR LED, YELLOW, 7.31 mm
File Size	148.35K / 4 Page	View it Online	Download Datasheet

				Taiwan Semiconductor Co., Ltd. Avago Technologies, Ltd.
Part No.	HLMP-C027-P0000 HLMP-C608-R00DD HLMP-C025-P0002 HLMP-C325-P00DD HLMP-C325-P0000 HLMP-C325-P00CA HLMP-C025-P00DD HLMP-C225-O00DD
OCR Text	...ithout damaging the led die and wirebond. it is not recommended that this device be operated at peak currents above the absolute maximum peak forward current. part numbering system hlmp - c x xx - x x x xx mechanical option 00: bulk 02: tap...
Description	0.5mm contact spacing, 1.0mm height, Top contact, Back flip FPC/FFC connectors; HRS No: 580-1225-5 50; Contact Mating Area Plating: Gold T-1 3/4 (5 mm) AlInGaP Lamp 的T 1 3 / 45毫米）的AlInGaP T-13/4 (5mm) AlInGaP Lamp 的T 13 / 4mm）的铝铟镓磷化物
File Size	143.75K / 8 Page	View it Online	Download Datasheet

For wirebond Found Datasheets File :: 255 Search Time::0.766ms
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