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Amphenol Communications Solutions |
Part No. |
54112-106341050LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54242-106301300LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-106360800LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-106361000LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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POLYFET[Polyfet RF Devices]
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Part No. |
F1063
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Description |
PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR
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File Size |
31.59K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54121-106361250LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-106361100LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 36 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-106301000LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 30 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Molex, Inc. MOLEX INC
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Part No. |
22-01-1063 22-01-1123
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Description |
Connector Housing; Gender:Female; Number of Contacts:6; Series:5051-NM; Body Material:PA Polyamide (Nylon) 6/6; Number of Rows:1; Pitch Spacing:2.5mm 6 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP CRIMP HOUSING, 2.5MM 12WAY ; Ways, No. of:12; Colour:White; Current rating:2.5A; Dielectric strength:1500V/m; Flammability rating:UL94V-0; Force, de-mating:0.5N; Force, mating:2N; Housing type:White Nylon UL94V-0; Material:Nylon;
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File Size |
64.52K /
1 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10127721-063GRLF
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Description |
Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 6 Position, 3.2mm Kink Tail (15u\\ Gold) plating, GW Compatible LCP, Black Color,Tape and Reel with cap.
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Tech specs |
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Official Product Page
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23 22 20 MICROPAC[Micropac Industries] Micropac Industries, Inc.
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Part No. |
61063-101 61063 61063-001
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Description |
PHOTODIODE “PILL PACK?/a> PHOTODIODE PILL PACK
Micropac Industries PHOTODIODE “PILL PACK” PHOTODIODE B>PILL PACK Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; Number of Contacts:3; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight PHOTO DIODE PHOTODIODE PILL PACK 光电二极管“丸包装
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File Size |
75.29K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54242-106361050LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54111-106361500LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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