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												Amphenol Communications Solutions |  
						| Part No. | 54122-411321800LF 
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						| Description | BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch 
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						Official Product Page
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												Amphenol Communications Solutions |  
						| Part No. | 59112-F32-18-076LF 
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						| Description | Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 36 Positions. 
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												Amphenol Communications Solutions |  
						| Part No. | 54112-109321800LF 
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						| Description | BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 32 Positions, 2.54mm (0.100in) Pitch. 
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						Official Product Page
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												Texas Instruments |  
						| Part No. | 5962-9321801QSA 
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						| Description | Octal Transparent D-type Latches With 3-State Outputs 20-CFP -55 to 125 
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												Texas Instruments |  
						| Part No. | 5962-9321801QRA 
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						| Description | Octal Transparent D-type Latches With 3-State Outputs 20-CDIP -55 to 125 
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						Official Product Page
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												Texas Instruments |  
						| Part No. | 5962-9321801Q2A 
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						| Description | Octal Transparent D-type Latches With 3-State Outputs 20-LCCC -55 to 125 
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						Official Product Page
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 Molex Electronics Ltd.
 
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						| Part No. | 44432-1801 0444321801 
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						| Description | 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits, Tin (Sn) Plating 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits, Tin (Sn) Plating
 
 
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						| File Size | 224.08K  / 
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