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  70543-0167 Datasheet PDF File

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    Molex, Inc.
Part No. 70543-0251 70543-0045 70543-0248 70543-0278 70543-0272 70543-0166 70543-0167 70543-0058 70543-0201
Description CGRID SL VHDR TIN 5 CKT 5 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
Header; No. of Contacts:11; Pitch Spacing:2.54mm; No. of Rows:1; Series:SL; Connector Body Material:Polyester; Mounting Type:PC Board; Terminal Type:Straight Pin 11 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGRID SL VHDR TIN 2 CKT 2 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGRID SL VHDR 15 GOLD 8 CKT 8 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGRID SL VHDR 15 GOLD 2 CKT 2 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid SL SMT Vhdr SR 150 30 SAu 3Ckt 3 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGRID SL VHDR SR 30 GOLD 4CKT 4 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid SL Srd VHdr SR 120 Tin 24Ckt 24 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid SL SMT Vhdr SR 120 15 SAu 3Ckt 3 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

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Renesas Electronics Corporation

Part No. TSI110-167CLY
Description Host Bridge
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90-0167

Maxim Integrated Products
Part No. 90-0167
Description PACKAGE LAND PATTERN, (E16) 0.150 QSOP, 16 LEADS

File Size 19.87K  /  1 Page

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Renesas Electronics Corporation

Part No. TSI110-167CL
Description Host Bridge
Tech specs    

Official Product Page

    70543-0022

Molex Electronics Ltd.
Part No. 70543-0022
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 23Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0024

Molex Electronics Ltd.
Part No. 70543-0024
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 25Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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Amphenol Communications Solutions

Part No. 68705-435HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0021

Molex Electronics Ltd.
Part No. 70543-0021
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 22Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-432HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0020

Molex Electronics Ltd.
Part No. 70543-0020
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 21Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0037

Molex Electronics Ltd.
Part No. 70543-0037
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 3Circuits, Tin (Sn) Plating

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-431HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0018

Molex Electronics Ltd.
Part No. 70543-0018
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 19Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 61127-0543LF
Description Header, Top Mount, Upper Deck(68Pins), VTB, 3.3V, 4.3mm s/o
Tech specs    

Official Product Page

    70543-0017

Molex Electronics Ltd.
Part No. 70543-0017
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 18Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 94937-0543LF
Description Header, Top Mount, Upper Deck(68Pins), 5V, 4.3mm s/o
Tech specs    

Official Product Page

    70543-0016

Molex Electronics Ltd.
Part No. 70543-0016
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 17Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-434HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

For 70543-0167 Found Datasheets File :: 138+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |   

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