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  70563-0041 Datasheet PDF File

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    70563-0041

Molex Electronics Ltd.
Part No. 70563-0041
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 7 Circuits, Tin (Sn) Plating

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Amphenol Communications Solutions

Part No. 68004-102HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Molex, Inc.
MOLEX INC
Part No. 70563-0115 70563-0017 70563-0116 70563-0054 70563-0041 70563-0053
Description 11 PIN MOLEX .180 W/O 11 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid SL Srd VHdr SR 180 15 SAu 18Ckt 18 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
12 PIN MOLEX .180 W/O 12 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
A-70563-0054 20 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid SL Srd VHdr SR 180 Tin 7Ckt 7 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid SL Srd VHdr SR 180 Tin 19Ckt

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Amphenol Communications Solutions

Part No. 68004-134HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    70563-0038

Molex Electronics Ltd.
Part No. 70563-0038
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 4Circuits, Tin (Sn) Plating

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Amphenol Communications Solutions

Part No. 68004-119HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    70563-0045

Molex Electronics Ltd.
Part No. 70563-0045
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 11Circuits, Tin (Sn) Plating

File Size 214.17K  /  4 Page

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Amphenol Communications Solutions

Part No. 68004-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    70563-0046

Molex Electronics Ltd.
Part No. 70563-0046
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 12Circuits, Tin (Sn) Plating

File Size 214.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 68000-411HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70563-0044

Molex Electronics Ltd.
Part No. 70563-0044
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 10Circuits, Tin (Sn) Plating

File Size 214.17K  /  4 Page

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Amphenol Communications Solutions

Part No. 10041994-750LF
Description Assembly, Bottom Mount, D/D(136Pins), VTB, Type 123, 3.3V, 5mm s/o, Right Push Rod Eject without Button, 9.5mm Eject Travel
Tech specs    

Official Product Page

    70563-0040

Molex Electronics Ltd.
Part No. 70563-0040
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 6 Circuits, Tin (Sn) Plating

File Size 214.17K  /  4 Page

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Amphenol Communications Solutions

Part No. 10121510-000416BLF
Description HPCE R/A Receptacle 4P16S
Tech specs    

Official Product Page

    70563-0023

Molex Electronics Ltd.
Part No. 70563-0023
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 24Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 68004-108HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 8 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    70563-0047

Molex Electronics Ltd.
Part No. 70563-0047
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 13Circuits, Tin (Sn) Plating

File Size 214.05K  /  4 Page

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Amphenol Communications Solutions

Part No. 68004-122HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    70563-0007

Molex Electronics Ltd.
Part No. 70563-0007
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 8Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 68004-132HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

For 70563-0041 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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