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  70563-0129 Datasheet PDF File

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    0705630129 70563-0129

Molex Electronics Ltd.
Part No. 0705630129 70563-0129
Description 2.54mm (.100) Pitch SL?/a> Header, Single Row, Vertical, .180 Pocket, Shrouded, 25Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 10129470-104LF
Description ExaMAX® 56Gb/s High Speed Orthogonal Connector, 6-Pair, 8 column, 160 position, Orthogonal Right Angle Header, No Guide Pin, Screw Mount.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70563-0051

Molex Electronics Ltd.
Part No. 70563-0051
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 17Circuits, Tin (Sn) Plating

File Size 214.05K  /  4 Page

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Amphenol Communications Solutions

Part No. 10129381-940001BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70563-0041

Molex Electronics Ltd.
Part No. 70563-0041
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 7 Circuits, Tin (Sn) Plating

File Size 214.17K  /  4 Page

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Amphenol Communications Solutions

Part No. 10129381-924002BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 24 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70563-0044

Molex Electronics Ltd.
Part No. 70563-0044
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 10Circuits, Tin (Sn) Plating

File Size 214.17K  /  4 Page

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Amphenol Communications Solutions

Part No. 10129381-916004BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70563-0046

Molex Electronics Ltd.
Part No. 70563-0046
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 12Circuits, Tin (Sn) Plating

File Size 214.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 10129381-950004BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70563-0045

Molex Electronics Ltd.
Part No. 70563-0045
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 11Circuits, Tin (Sn) Plating

File Size 214.17K  /  4 Page

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Amphenol Communications Solutions

Part No. 10129381-930003BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70563-0014

Molex Electronics Ltd.
Part No. 70563-0014
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 15Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 10129381-908002BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70563-0021

Molex Electronics Ltd.
Part No. 70563-0021
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 22Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 10129381-912002BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    705-63-0011 A-70563-0011

Molex Electronics Ltd.
Part No. 705-63-0011 A-70563-0011
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 10129381-924001BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 24 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    705-63-0015 A-70563-0015

Molex Electronics Ltd.
Part No. 705-63-0015 A-70563-0015
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 10129206-1001013LF
Description DDR4 DIMM, Ultra Low Profile, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
Tech specs    

Official Product Page

For 70563-0129 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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