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Molex Electronics Ltd.
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| Part No. |
87759-1850 0877591851 87759-1851
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Surface Mount, Vertical, 18 Circuits, 0.38楼矛m (30楼矛) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-
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| File Size |
174.25K /
4 Page |
 View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
5962-8775901MSA
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| Description |
Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
5962-8775901M2A
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| Description |
Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
5962-8775901MRA
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| Description |
Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87185-127HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87185-104HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87185-116HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87185-133HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10110818-5100HFLF
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| Description |
SFP+ Cable Assembly, 24 AWG, 10.0 meters, passive -standard raw cable, halogen free.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-8516-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87185-111HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
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Official Product Page
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Bom2Buy.com
Price and Availability
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