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Molex Electronics Ltd.
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| Part No. |
87911-8011 0879118011
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 80 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 80 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.70K /
6 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10076801-101-28LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 28 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-5211
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 52 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.70K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10076801-101-12LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 12 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10076801-101-40LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 40 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-801-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-6211
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 62 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10076801-101-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 14 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-801-12LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 12 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10076801-105-12LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 12 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95293-801-17LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,17 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10076801-105-20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 20 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-801-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Price and Availability
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