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  87914-4416 Datasheet PDF File

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    0879144416 87914-4416

Molex Electronics Ltd.
Part No. 0879144416 87914-4416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 44 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 75844-879-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MIC4416/4417

Micrel Semiconductor
Part No. MIC4416/4417
Description IttyBittyTM Low-Side MOSFET Driver

File Size 74.04K  /  10 Page

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Amphenol Communications Solutions

Part No. 68604-416HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-1816

Molex Electronics Ltd.
Part No. 87914-1816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.50K  /  48 Page

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Amphenol Communications Solutions

Part No. 92634-416HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 16 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

    87914-1016

Molex Electronics Ltd.
Part No. 87914-1016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 10 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.32K  /  48 Page

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Amphenol Communications Solutions

Part No. 134-4416-21H
Description Paladin,backplane connectors,4-Pair, 6 Column, Right End Wall, Right Angle Male, 2.25mm Wipe, APP
Tech specs    

Official Product Page

    87914-4216

Molex Electronics Ltd.
Part No. 87914-4216
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 42 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 68764-416HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-1416

Molex Electronics Ltd.
Part No. 87914-1416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.32K  /  48 Page

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Amphenol Communications Solutions

Part No. 68004-416HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    87914-0807

Molex Electronics Ltd.
Part No. 87914-0807
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging

File Size 3,776.34K  /  48 Page

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Amphenol Communications Solutions

Part No. 10154416-192SLF
Description M-SERIES 56, 1 MM Plug, 4-Pair, 20-Column, 260-PIN, 30u\\. Plating
Tech specs    

Official Product Page

    87914-0806

Molex Electronics Ltd.
Part No. 87914-0806
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 759.80K  /  11 Page

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Amphenol Communications Solutions

Part No. 74744-169LF
Description 5 Row Signal Header, Straight, STB, Wide body, 8 Mod
Tech specs    

Official Product Page

    87914-1616

Molex Electronics Ltd.
Part No. 87914-1616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions

Part No. 134-4416-11D
Description Paladin,backplane connectors,4-Pair, 6 Column, Right End Wall, Right Angle Male, 1.5mm Wipe, NiS
Tech specs    

Official Product Page

    87914-4016

Molex Electronics Ltd.
Part No. 87914-4016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 40 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 131-4416-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

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