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    NFSW036BT NFSW036B

List of Unclassifed Manufacturers
ETC[ETC]
N.A.
Part No. NFSW036BT NFSW036B
OCR Text ...in corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon...
Description SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED

File Size 706.32K  /  14 Page

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    TPS819

TOSHIBA[Toshiba Semiconductor]
Part No. TPS819
OCR Text ...sture-proof Packing (1) (2) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel. The optical characteristics of the devices may be affected by exposure to moisture in the air before sold...
Description TOSHIBA Photo IC Silicon Epitaxial Planar

File Size 167.45K  /  10 Page

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    AGERE[Agere Systems]
Part No. 980 980-TYPE
OCR Text ... radius is 25 mm. Connection To avoid degradation in performance, mount the module on the board as follows (see Figure 2): 1. Place the bottom flange of the module on a flat heat sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in size. ...
Description 980-Type Ultrahigh- Reliability Pump Laser Module
980-Type Ultrahigh- Reliability Pump Laser Module
Ultrahigh-Reliability Pump Laser Module

File Size 178.02K  /  8 Page

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    Macronix International Co., Ltd.
njr
Part No. NJL6170R-6171R NJL6171R
OCR Text ...e profile : Same to the above - avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface temperature will be higher than lead itself. 3) The other method avoid rapid heating up...
Description NJL6171R NJL6171R
From old datasheet system
PIN PHOTO DIODE

File Size 133.89K  /  6 Page

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INFINEON[Infineon Technologies AG]
Part No. SBH52444G-FSAN SBH52444X SBH52444Z-FSAN SBH52444N-FSAN SBH52444P-FSAN SBH52444X-FSAN
OCR Text ...Eye Safety Eye Safety Ensure to avoid exposure of human eyes to high power laser diode emitted laser beams. Especially do not look directly into the laser diode or the collimated laser beam when the diode is activated. Class 3B Laser Produc...
Description High Power BIDI Optical Standard Module 1310 nm Emitting/ 1550 nm Receiving
Components and FTTx solutions - Tx 1310nm/Rx 1550nm, 155 MBit/s TIA
High Power BIDI Optical Standard Module 1310 nm Emitting 1550 nm Receiving
From old datasheet system
High Power BIDI Optical Standard Module 1310 nm Emitting, 1550 nm Receiving
Snap-in Panel Mount Switch, Double Pole Double Throw (DPDT) Circuitry, 10 A at 277 Vac, Bullet Nose Plunger Actuator, Silver Contacts, Quick Connect Termination

File Size 277.23K  /  13 Page

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    INFINEON[Infineon Technologies AG]
Part No. SBM82314X SBM82314 SBM82314Z SBM81314G SBM81314N SBM81314Z SBM82314G SBM82314N
OCR Text ...Eye Safety Eye Safety Ensure to avoid exposure of human eyes to high power laser diode emitted laser beams. Especially do not look directly into the laser diode or the collimated laser beam when the diode is activated. Class 3B Laser Produc...
Description Medium Power BIDI Optical Standard Module 1550 nm Emitting, 1310 nm Receiving
From old datasheet system
Transceiver
Medium Power BIDI Optical Standard Module 1550 nm Emitting/ 1310 nm Receiving
Components and FTTx solutions - Tx 1550nm/Rx 1310nm, Medium Power

File Size 231.20K  /  11 Page

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    Atmel Corp
Part No. U4065B
OCR Text ...F. No dc current is allowed. To avoid overload of this stage an internal detector watches the input level and causes current at the AGCOUT pin. IF1OUT VS Vref Output of the second IF amplifier: The parallel output capacitance to ground ...
Description FM front end
From old datasheet system

File Size 156.45K  /  23 Page

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    TORX180

TOSHIBA[Toshiba Semiconductor]
Part No. TORX180
OCR Text .... The protective cap is used to avoid malfunction when the optical module is not in use. Note that it is not dust or waterproof. As mentioned before, optical modules are optical components. Thus, in principle, soldering where there may be f...
Description From old datasheet system
FIBER OPTIC RECEIVING MODULE FOR SIMPLEX DIGITAL SIGNAL TRANSMISSION

File Size 157.63K  /  9 Page

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    C-3001Y

PARA LIGHT ELECTRONICS CO., LTD.
Part No. C-3001Y
OCR Text ...face of display on the panel to avoid damaging the display. regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin & copper and silver is proposed with the temperatu...
Description 3.00 INCH SINGLE DIGIT DISPLAY

File Size 202.96K  /  11 Page

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    C-3001SR

PARA LIGHT ELECTRONICS CO., LTD.
Part No. C-3001SR
OCR Text ...face of display on the panel to avoid damaging the display. regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin & copper and silver is proposed with the temperatu...
Description 3.00 INCH SINGLE DIGIT DISPLAY

File Size 189.24K  /  10 Page

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