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Amphenol Communications Solutions |
| Part No. |
10069525-201400LF
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| Description |
Bergstak® 0.80mm Pitch, Board to Board, Vertical, Plug Assembly, 200 Positions, Dual Row.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10137925-2012LF
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| Description |
Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 20 Positions, Non GW Compatible LCP, Tape and Reel. .
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-520122000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10137925-2011LF
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| Description |
Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 20 Positions, GW Compatible LCP, Tape and Reel. .
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| Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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| Part No. |
BBS-15 BBS-1/4 BBS-2/10 BBS-1-8/10 BBS-10 BBS-1-6/10 BBS-1-1/2 BBS-3/4 BBS-6 BBS-5 BBS-7 BBS-4/10 BBS-25 BBS-30
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| Description |
72-Mbit QDR™-II SRAM 2-Word Burst Architecture
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL™ Architecture
72-Mbit DDR-II SRAM 2-Word Burst Architecture
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL™ Architecture
36-Mbit QDR™-II SRAM 4-Word Burst Architecture
Fuse
256K (32K x 8) Static RAM
64/256/512/1K/2K/4K x 18 Synchronous FIFOs
Low-Voltage 64/256/512/1K/2K/4K/8K x 9 Synchronous FIFOs
Neuron® Chip Network Processor
64-Kbit (8K x 8) Static RAM
72-Mbit QDR™-II SRAM 2-Word Burst Architecture 保险
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| File Size |
26.66K /
1 Page |
 View
it Online |
Download Datasheet
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Price and Availability
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