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SGS Thomson Microelectronics
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Part No. |
AN262
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OCR Text |
...vection and irradiation from an emiting area corresponding to the silicon die and the package die pad. since heat transmission through the lead frame is very poor, dissipation does not depend greatly on substrate type. in fact, samples sold... |
Description |
THERMAL MANAGEMENT IN SOURFACE MOUNTING
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File Size |
419.39K /
15 Page |
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