K9F5608D0C-D pdf Datasheet P1 Part Num --- IC-ON-LINE


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K9F5608D0C-D Datasheet PDF File

For K9F5608D0C-D Found Datasheets File :: 5+ Page :: | <1> |

					SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd. http://
Part No.	K9F5616D0C-P K9F5608D0C-P K9F5616D0C-D K9F5616D0C-Y K9F5608D0C-D K9F5608D0C-Y K9F5616D0C-H K9F5608Q0C-D K9F5608Q0C-H
Description	TV 37C 37#16 PIN RECP TV 37C 37#16 SKT RECP 32M的8位，16x 16位NAND闪存 32M x 8 Bit , 16M x 16 Bit NAND Flash Memory 32M的8位，16米x 16位NAND闪存 Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TV07; Number of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight 32M的8位，16米x 16位NAND闪存
File Size	692.99K / 42 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	LD09P24A4GV00LF
Description	D-Subminiature Economy Range, Input Output Connectors, Signal 9 way Pin Straight, Solder, 50 cycles, Harpoons + Female Screw UNC 4 - 40 + Elec cont., 1.6 mm PCB thickness
Tech specs				Official Product Page

HUA FENG CIRCUIT

					http:// Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K9F5608U0C-VIB0 K9F5608Q0C-HIB0 K9F5608U0C-HIB0 K9F5616Q0C-HIB0 K9F5616U0C-P K9F5608U0C-PCB0 K9F5608Q0C-D K9F5616U0C-D K9F5608U0C-DCB0 K9F5608U0C-DIB0 K9F5616U0C-DCB0 K9F5608U0C-HCB0 K9F5616Q0C-HCB0 K9F5616U0C-HCB0 K9F5608U0C-YCB0 K9F5616U0C-YCB0 K9F5616U0C-YIB0 K9F5608U0C-YIB0 K9F5608U0C-FCB0 K9F5616Q0C-DCB0 K9F5608U0C-FIB0 K9F5616U0C-HIB0 K9F5608Q0C-HCB0 K9F5608Q0C-DIB0 K9F5608U0C-PIB0 K9F5616U0C-PCB0 K9F5608U0C-VCB0 K9F5608Q0C-DCB0 K9F5608D0C-D K9F5608D0C-P K9F5608D0C-Y K9F5616Q0C-DIB0 K9F5616U0C-DIB0 K9F5608Q0C-H
Description	TV 3C 3#20 PIN WALL RECP 512Mb/256Mb 1.8 NAND闪存勘误 512Mb/256Mb 1.8V NAND Flash Errata 512Mb/256Mb 1.8 NAND闪存勘误 32M x 8 Bit / 16M x 16 Bit NAND Flash Memory
File Size	666.30K / 39 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	DB5W5P543M40LF
Description	D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 5W5 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Without Accessory, Back: Metal Brackets.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9F5608D0C K9F5608D0C-D K9F5608D0C-H K9F5608D0C-P K9F5608D0C-Y K9F5616U0C-Y K9F5608Q0C K9F5608Q0C-D K9F5608Q0C-H K9F5608U0C K9F5608U0C-D K9F5608U0C-F K9F5608U0C-H K9F5608U0C-P K9F5608U0C-V K9F5608U0C-Y K9F5616D0C K9F5616D0C-D K9F5616D0C-H K9F5616D0C-P K9F5616D0C-Y K9F5616Q0C K9F5616Q0C-D K9F5616Q0C-H K9F5616U0C K9F5616U0C-D K9F5616U0C-H K9F5616U0C-P K9F5616Q0C-HCB0 K9F5616Q0C-DCB0 K9F5616Q0C-DIB0 K9F5616Q0C-HIB0
Description	32M x 8 Bit / 16M x 16 Bit NAND Flash Memory 512Mb/256Mb 1.8V NAND Flash Errata 32M x 8 Bit , 16M x 16 Bit NAND Flash Memory
File Size	679.73K / 42 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	DCV8W8P543M30LF
Description	D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 8W8 Pin Right Angle Solder 30A, Europe Standard, 500 Cycles, Front: Female Screw Lock UNC 4.40, Back: Metal Brackets.
Tech specs				Official Product Page

					SAMSUNG[Samsung semiconductor]
Part No.	K9F5608UOC K9F56XXQ0C K9F5608D0C K9F5608D0C-D K9F5608D0C-H K9F5608D0C-P K9F5608D0C-Y K9F5608Q0C K9F5608Q0C-D K9F5608Q0C-H K9F5608U0C K9F5608U0C-D K9F5608U0C-F K9F5608U0C-H K9F5608U0C-P K9F5608U0C-V K9F5608U0C-Y K9F5616D0C K9F5616D0C-D K9F5616D0C-H K9F5616D0C-P K9F5616D0C-Y K9F5616Q0C K9F5616Q0C-D K9F5616Q0C-H K9F5616U0C K9F5616U0C-D K9F5616U0C-H K9F5616U0C-P K9F5616U0C-Y
Description	32M x 8 Bit 16M x 16 Bit NAND Flash Memory
File Size	668.51K / 41 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	DAO3W3P500A30LF
Description	D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 3W3 Pin Right Angle Solder 30A, Europe Standard, 200 Cycles, Front: Threaded Insert UNC 4.40, Back: Without Accessory on PCB.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9F5608Q0C K9F5608Q0C-D K9F5608Q0C-DCB0 K9F5608Q0C-DIB0 K9F5608Q0C-H K9F5608Q0C-HCB0 K9F5608Q0C-HIB0 K9F5608U0C K9F5608U0C-D K9F5608U0C-DCB0 K9F5608U0C-DIB0 K9F5608U0C-F K9F5608U0C-FCB0 K9F5608U0C-FIB0 K9F5608U0C-H K9F5608U0C-HCB0 K9F5608U0C-HIB0 K9F5608U0C-P K9F5608U0C-PCB0 K9F5608U0C-PIB0 K9F5608U0C-V K9F5608U0C-VCB0 K9F5608U0C-VIB0 K9F5608U0C-Y K9F5608U0C-YCB0 K9F5608U0C-YIB0 K9F1208Q0A K9F5616U0C K9F5616U0C-D K9F5616U0C-DCB0 K9F5616U0C-DIB0 K9F5616U0C-H K9F5616U0C-HCB0 K9F5616U0C-HIB0 K9F5616U0C-P K9F5616U0C-PCB0 K9F5616U0C-PIB0 K9F5616U0C-Y K9F5616U0C-YCB0 K9F5616U0C-YIB0 K9F5616Q0C K9F5616Q0C-D K9F5616Q0C-DCB0 K9F5616Q0C-DIB0 K9F5616Q0C-H K9F5616Q0C-HCB0 K9F5616Q0C-HIB0 K9F1208Q0A-XXB0 K9F5608D0C-H K9F5608D0C-D K9F5608D0C-Y K9F5608D0C-P K9F5608U0M
Description	32M x 8 Bit NAND Flash Memory 32M x 8 Bit / 16M x 16 Bit NAND Flash Memory 512Mb/256Mb 1.8V NAND Flash Errata
File Size	653.97K / 39 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	DAL3W3P500M30LF
Description	D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 3W3 Pin Right Angle Solder 30A, Europe Standard, 200 Cycles, Front: Threaded Insert M3, Back: Metal Brackets.
Tech specs				Official Product Page

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