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				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LP6836P100-3 LP6836P100-2 LP6836P100 LP6836P100-1
OCR Text	packaged 0.25W Power PHEMT * * * * * GATE +24.5 dBm Typical Power at 15 GHz 12 dB Typical Power Gain at 15 GHz Low Intermodulation Distortion 55% Power-Added-Efficiency Color-coded by IDSS range SOURCE DRAIN DESCRIPTION AND ...
Description	packaged 0.25W Power PHEMT
File Size	22.31K / 2 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LP6836P70
OCR Text	packaged MEDIUM POWER PHEMT * FEATURES 23 dBm Output Power at 1-dB Compression at 15 GHz 11.5 dB Power Gain at 15 GHz 50% Power-Added Efficiency LP6836P70 * DESCRIPTION AND APPLICATIONS The LP6836P70 is a packaged AlGaAs/InGaAs/...
Description	packaged MEDIUM POWER PHEMT
File Size	58.53K / 3 Page	View it Online	Download Datasheet

				M.S. Kennedy Corporatio... MSK[M.S. Kennedy Corporation]
Part No.	MSK183 MSK184G MSK185 MSK185G MSK182 MSK182G MSK183G MSK184
OCR Text	...current out DAC. The MSK 182 is packaged in a hermetically sealed 14 pin power DIP with bolt down tabs for applications that require heat sinking. The MSK 183 is packaged in a low cost ceramic SIP and the MSK 184 is packaged in a TO-3. The ...
Description	DUAL HIGH VOLTAGE/ HIGH CURRENT OPERATIONAL AMPLIFIER
File Size	473.83K / 8 Page	View it Online	Download Datasheet

				Cypress Semiconductor
Part No.	CY7C1079DV33 CY7C1079DV33-12B2XI
OCR Text	... a 19 a 20 a 21 [1] note 1. bga packaged device is offered in single ce and dual ce options. in this data sheet, for a dual ce device, ce refers to the internal logical combination of ce 1 and ce 2 such that when ce 1 is low and ce 2 ...
Description	32-Mbit (4 M x 8) Static RAM TTL Compatible Inputs and Outputs
File Size	387.05K / 14 Page	View it Online	Download Datasheet

				N.A.
Part No.	TL1451CNSR
OCR Text	...nufacture of SOIC, SOP and SSOP packaged devices assembled in TI facilities. Some customers were notified under this PCN number on December 11, 2000 that TI planned to qualify this mold compound for surface mount and some dual-in-line (DIP)...
Description	-
File Size	169.79K / 18 Page	View it Online	Download Datasheet

				CALMIRCO[California Micro Devices Corp]
Part No.	120608 CM1206 L06 CM1206-04CP CM1206-04CS CM1206-08CP CM1206-08CS CM120616 CM1206-16CP CM1206-16CS
OCR Text	...Details The CM1206 devices are packaged in custom Chip Scale Packages (CSP). CM1206-04 6-bump CSP Mechanical Specifications The CM1206-04 devices are packaged in a 6-bump custom Chip Scale Package (CSP). Dimensions are presented below. Mec...
Description	ESD Protection Arrays Chip Scale Package ESD Protection Arrays, Chip Scale Package
File Size	195.95K / 7 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	FMS2014QFN FMS2014-001 FMS2014-001-EB
OCR Text	packaged pHEMT Switch Excellent low control voltage performance Excellent harmonic performance under GSM/DCS/PCS/EDGE power levels Very high Tx-Rx isolation: >28dB typ. at 1.8GHz Very low Insertion loss: 0.5dB at 1.8GHz Very low control cur...
Description	High Power GaAs SPDT Switch
File Size	184.93K / 6 Page	View it Online	Download Datasheet

				California Micro Devices Corp
Part No.	PACUSB-D1 PACUSB-D2 PACUSB-D2Y5 PACUSB-D3Y5 PACUSB-D1Y5 PACUSB-D1Y5R PACUSB-D1YB5 PACUSB-D1YB5R PACUSB-D2Y5R PACUSB-D2YB5 PACUSB-D2YB5R PACUSB-D3 PACUSB-D3Y5R PACUSB-D3YB5 PACUSB-D3YB5R
OCR Text	...ls PACUSB-D1/D2/D3 devices are packaged in SOT23-5 and SC70-5 packages. SOT23-5 Mechanical Specifications: Dimensions for PACUSB-D1/D2/D3 devices packaged in a 5-pin SOT23 package are presented below. For complete information on the SOT23-...
Description	USB Downstream Port Terminator
File Size	303.92K / 9 Page	View it Online	Download Datasheet

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