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resin-molded Datasheet PDF File

For resin-molded Found Datasheets File :: 862 Search Time::1.109ms
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				TE Connectivity, Ltd. HIROSE ELECTRIC Co., Ltd. Hirose Electric USA, INC. HIROSE[Hirose Electric] http://
Part No.	DF7-1DS-3.96C DF7-1DS-3.96DS DF7-1DS-3.96DSA DF7-2DS-3.96C DF7-2DS-3.96DS DF7-2DS-3.96DSA DF7-3DS-3.96C DF7-3DS-3.96DS DF7-3DS-3.96DSA DF7-4DS-3.96C DF7-4DS-3.96DS DF7-4DS-3.96DSA DF7-5DS-3.96C DF7-5DS-3.96DS DF7-5DS-3.96DSA DF7-1618PC DF7-1618PCF DF7-1618SC DF7-1618SCF DF7-5S-3.96DSA DF7-1DP-3.96C DF7-1DP-3.96DS DF7-1DP-3.96DSA DF7-1EP-3.96C DF7-1EP-3.96DS DF7-1EP-3.96DSA DF7-1P-3.96C DF7-1P-3.96DS DF7-1P-3.96DSA DF7-1RS_P-3.96C DF7-1RS_P-3.96DS DF7-1RS_P-3.96DSA DF7-1S-3.96C DF7-1S-3.96DS DF7-1S-3.96DSA DF7-2022PC DF7-2022PCF DF7-2022SC DF7-2022SCF DF7-2426PC DF7-2426PCF DF7-2426SC DF7-2426SCF DF7-2DP-3.96C DF7-2DP-3.96DS DF7-2DP-3.96DSA DF7-2EP-3.96C DF7-2EP-3.96DS DF7-2EP-3.96DSA DF7-2P-3.96C DF7-2P-3.96DS DF7-2P-3.96DSA DF7-2RS_P-3.96C DF7-2RS_P-3.96DS DF7-2RS_P-3.96DSA DF7-2S-3.96C DF7-2S-3.96DS DF7-2S-3.96DSA DF7-3DP-3.96C DF7-3DP-3.96DS DF7-3DP-3.96DSA DF7-3EP-3.96C DF7-3EP-3.96DS DF7-3EP-3.96DSA DF7-3P-3.96C DF7-3P-3.96DS DF7-3P-3.96DSA DF7-3RS_P-3.96C DF7-3RS_P-3.96DS DF7-3RS_P-3.96DSA DF7-3S-3.96C DF7-3S-3.96DS DF7-3S-3.96DSA DF7-4DP-3.96C DF7-4DP-3.96DS DF7-4DP-3.96DSA DF7-4EP-3.96C DF7-4EP-3.96DS DF7-4EP-3.96DSA DF7-4P-3.96C DF7-4P-3.96DS DF7-4P-3.96DSA DF7-4RS_P-3.96C
OCR Text	...ck Prevention Glass reinforced resin is used in the pin header bodies to prevent solder cracks caused by the heat shrinkage. Board Eyele...molded-in lance. Deflect the lance as shown. Molded-in lance Pull-out direction 2. Assure t...
Description	HEADBOARD FOR KAC-9637 三点九六毫米间距微型连接器内部电源（UL认证，及C - UL和TUV认证 3.96 mm Pitch Miniature Connectors for Internal Power Supplies (UL,C-UL and TUV Listed) 三点九六毫米间距微型连接器内部电源（UL认证，及C - UL和TUV认证 RES 10K0 SM 1/4W B 1206CS THNF T&R 3.96 mm Pitch Miniature Connectors for Internal Power Supplies (UL /C-UL and TUV Listed) 3.96 mm Pitch Miniature Connectors for Internal Power Supplies (UL,C-UL and TUV Listed)
File Size	663.31K / 16 Page	View it Online	Download Datasheet

				MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	PM400DAS060 PM400HSA12 PM800HSA06 PM75RVA060 PM400DVA060 PM100CVA120
OCR Text	...U V W 1. Case 2. Epoxy Resin 3. Input Signal Terminal 4. SMT Resistor 5. Gate Control IC 6. SMT Capacitor 7. IGBT Chip 8. Free-whee...molded case similar to the U-Series IGBT is used. Like the U-Series IGBT described in Section 4.1.5,...
Description	USING INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE
File Size	922.36K / 31 Page	View it Online	Download Datasheet

				TOKO Inc. TOKO[TOKO, Inc]
Part No.	TK65015 TK65015M TK65015MBX TK65015MTL
OCR Text	...CURRENT (mA) Handling Molded Resin Packages All plastic molded packages absorb some moisture from the air. If moisture absorption occurs prior to soldering the device into the printed circuit board, increased separation of the lead from ...
Description	STEP-UP VOLTAGE CONVERTER WITH VOLTAGE MONITOR
File Size	116.06K / 8 Page	View it Online	Download Datasheet

				TOSHIBA[Toshiba Semiconductor]
Part No.	TLOU180P TLSU180P TLYU180P
OCR Text	...e without forming stress to the resin. Soldering should be performed after lead forming. This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp,please ensure that it will not be affected by this IR l...
Description	TOSHIBA InGaALP LED
File Size	130.04K / 6 Page	View it Online	Download Datasheet

				TOSHIBA[Toshiba Semiconductor]
Part No.	TLSH156P
OCR Text	...e without forming stress to the resin. Soldering should be performed after lead forming. This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR ...
Description	TOSHIBA LED Lamp InGaA?P Red Light Emission TOSHIBA LED Lamp InGaAГP Red Light Emission TOSHIBA LED Lamp InGaAP Red Light Emission
File Size	141.13K / 4 Page	View it Online	Download Datasheet

				TOSHIBA[Toshiba Semiconductor]
Part No.	TLSH180P
OCR Text	...e without forming stress to the resin. Soldering should be performed after lead forming. This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR ...
Description	TOSHIBA LED Lamp InGaA?P Red Light Emission TOSHIBA LED Lamp InGaAГP Red Light Emission TOSHIBA LED Lamp InGaAP Red Light Emission
File Size	119.12K / 4 Page	View it Online	Download Datasheet

				TOSHIBA[Toshiba Semiconductor]
Part No.	TLSU125 TLSU126
OCR Text	...e without forming stress to the resin. Soldering should be performed after lead forming. This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR ...
Description	TOSHIBA LED Lamp InGaA?P Red Light Emission TOSHIBA LED Lamp InGaAГP Red Light Emission TOSHIBA LED Lamp InGaAP Red Light Emission
File Size	118.44K / 4 Page	View it Online	Download Datasheet

				TOSHIBA[Toshiba Semiconductor] Newhaven Display International, Inc.
Part No.	TLYH180P TLYH180PVW
OCR Text	...e without forming stress to the resin. Soldering should be performed after lead forming. This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR ...
Description	LED Lamp InGaAlP Yellow Light Emission TOSHIBA LED Lamp InGaAP Yellow Light Emission TOSHIBA LED Lamp InGaAГP Yellow Light Emission T-1 3/4 SINGLE COLOR LED, HIGH INTENSITY YELLOW, 5 mm PLASTIC PACKAGE-2
File Size	115.91K / 4 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TOTX173
OCR Text	...n wafer crystallization or mold resin stress. The detailed causes are, however, not clear. The life of light emitters is greatly influenced ...molded construction with wire fixed by resin. This structure is relatively sound against vibration o...
Description	FIBER OPTIC TRANSMITTING MODULE FOR DIGITAL AUDIO EQUIPMENT
File Size	116.31K / 5 Page	View it Online	Download Datasheet

				TOSHIBA[Toshiba Semiconductor]
Part No.	TOTX176
OCR Text	...n wafer crystallization or mold resin stress. The detailed causes are, however, not clear. The life of light emitters is greatly influenced ...molded construction with wire fixed by resin. This structure is relatively sound against vibration o...
Description	FIBER OPTIC TRANSMITTING MODULE
File Size	119.67K / 5 Page	View it Online	Download Datasheet

For resin-molded Found Datasheets File :: 862 Search Time::1.109ms
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