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resin-molded Datasheet PDF File

For resin-molded Found Datasheets File :: 1274 Search Time::5.063ms
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				NEC
Part No.	2SB1453
OCR Text	...equipment. In addition, a small resin-molded insulation type package contributes to high-density mounting and reduction of mounting cost. PACKAGE DRAWING (UNIT: mm) FEATURES * High DC current amplifier ratio hFE 100 (VCE = -5 V, IC ...
Description	PNP epitaxial silicon power transistor
File Size	134.93K / 7 Page	View it Online	Download Datasheet

				Unity Opto Technology Co., Ltd. UOT[Unity Opto Technology]
Part No.	MIE-406A2U
OCR Text	...s otherwise noted. 2. Protruded resin under flange is 1.5 mm (.059") max. 3. Lead spacing is measured where the leads emerge from the package. Absolute Maximum Ratings @@ A=25oC TTA=25o Parameter Power Dissipation Peak Forward Current(3...
Description	KPT05A14-19S 的AlGaAs /砷化镓高功率- 46封装红外发光二极 AlGaAs/GaAs HIGH POWER TO-46 PACKAGE INFRARED EMITTING DIODE
File Size	31.93K / 2 Page	View it Online	Download Datasheet

				NEC[NEC]
Part No.	SVHB21V684M SVHB21V105M SVHB21E105M SVHB21D105K SVHB21C105M SVHB21A475M SVHD21V685M SVHD21E106M SVHD21D156M SVHD21A336M SVHC1A156M
OCR Text	RESIN MOLDED TANTALUM CHIP CAPACITORS HIGH RELIABILITY NEC's SV/H series solid tantalum capacitor has developed for automotive application. Comparing to the former type (R Series), the higher reliability and the higher performance have b...
Description	SURFACE MOUNT RESIN MOLDED TANTALUM CHIP CAPACITORS HIGH RELIABILITY
File Size	97.48K / 20 Page	View it Online	Download Datasheet

				NEC
Part No.	2SC4552
OCR Text	...actuators. In addition, a small resin-molded insulation type package contributes to high-density mounting and reduction of mounting cost. PACKAGE DRAWING (UNIT: mm) FEATURES * High hFE and low VCE(sat): hFE 100 (VCE = 2 V, IC = 3 A)...
Description	Silicon transistor
File Size	165.53K / 7 Page	View it Online	Download Datasheet

				FUJI[Fuji Electric]
Part No.	ESJC13
OCR Text	resin molded type high voltage diode in small size package which is sealed (a multilayed mesa type silicon chip) by epoxy resin. (9kV/450mA,12kV/350mA ) Outline Type Name, Lot No. (3) O 1.2 (4) Drawings Cathode Mark O 7.5 (2) (1...
Description	HIGH VOLTEGE DIODE
File Size	89.19K / 2 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC
Part No.	T2SBA40 T2SBA60 T2SBA80
OCR Text	... Data * * * Case: Molded Epoxy Resin Terminals: Plated Leads, Solderable per MIL-STD-202, Method 208 Polarity: Molded on Body 2542 Highlander Way ! Carrollton, TX 75006 UNIT: mm Maximum Ratings & Characteristics Single Phase, 60 ...
Description	1.5-AMPERE SILICON BRIDGE RECTIFIER From old datasheet system
File Size	39.09K / 2 Page	View it Online	Download Datasheet

				Cystech Electonics Corp... Unisonic Technologies Co., Ltd. 全宇昕科技股份有限公司 CYSTEKEC[Cystech Electonics Corp.] DENSEI-LAMBDA
Part No.	ZD75V0 ZD43V0 ZD68V0 ZD02V4 ZD02V4S2 ZD02V7 ZD03V0 ZD03V3 ZD03V6 ZD03V9 ZD04V3 ZD04V7 ZD05V1 ZD06V2 ZD06V8 ZD07V5 ZD08V2 ZD09V1 ZD10V0 ZD11V0 ZD12V0 ZD13V2 ZD15V0 ZD16V2 ZD18V0 ZD20V0 ZD22V0 ZD24V2 ZD27V0 ZD30V0 ZD33V0 ZD36V0 ZD39V0 ZD47V0 ZD51V0 ZD56V0 ZD62V0 ZD05V6
OCR Text	... plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek r...
Description	200mW SOD-323 Zener Voltage Regulators 全新00mW的SOD - 323封装稳压
File Size	151.22K / 4 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TORX193
OCR Text	...ing module case uses conductive resin, shield by connecting the reinforcing pin at a front end of the module to GND. When using this optical...molded construction with wire fixed by resin. This structure is relatively sound against vibration o...
Description	FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO EQUIPMENT AND NAVIGATION SYSTEM
File Size	144.89K / 8 Page	View it Online	Download Datasheet

				EPCOS[EPCOS]
Part No.	B45196P B45196P1225206 B45196P1225209 B45196P1225106 B45196P1225109 B45198P1225106 B45198P1225109 B45198P1225_509 B45196P1225_306 B45196P1225_309 B45196P1225_406 B45196P1225_409 B45196P1225_506 B45196P1225_509 B45198P1225_206 B45198P1225_209 B45198P1225_306 B45198P1225_309 B45198P1225_406 B45198P1225_409 B45198P1225_506 B45196P1225306 B45196P1225309 B45196P1225406 B45196P1225409 B45196P1225506 B45196P1225509 B45198P1225206 B45198P1225209 B45198P1225306 B45198P1225309 B45198P1225406 B45198P1225409 B45198P1225506
OCR Text	... Encapsulation: molded epoxy resin NiFe; tinned surface Sn100 or gold-plated Reduced slot length for case size A KTA0254-9-E Positive pole marking Case size Dimensions in mm (inches) L W 1,6 0,2 (,063,008) 2,8 0,2 (,110,008...
Description	TANTALUM CHIP CAPACITORS
File Size	122.69K / 11 Page	View it Online	Download Datasheet

				Unity Opto Technology Co., Ltd. Vishay Intertechnology, Inc. UOT[Unity Opto Technology]
Part No.	MIE-324H4 324H4
OCR Text	...s otherwise noted. 2. Protruded resin under flange is 1.5 mm (.059") max. 3. Lead spacing is measured where the leads emerge from the package. Absolute Maximum Ratings @ TA=25oC Parameter Power Dissipation Peak Forward Current(300pps,10...
Description	GaAlAs T-1 PACKAGE INFRARED EMITTING DIODE 发动器的T 1包红外发光二极管 Infrared Emitting Diodes (IRED) 红外发光二极管（登记合格决定
File Size	30.35K / 2 Page	View it Online	Download Datasheet

For resin-molded Found Datasheets File :: 1274 Search Time::5.063ms
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